Lee Seong-Hee, Lim Cha-Yong
Department of Advanced Materials Science and Engineering, Mokpo National University, Muan-gun 534-729, Jeonnam, Korea.
Department of Materials Technology, Korea Institute of Materials Science, 66 Sangnam-dong, Changwon, 641-010, Korea.
J Nanosci Nanotechnol. 2018 Mar 1;18(3):1851-1855. doi: 10.1166/jnn.2018.15005.
A nanostructured deoxidized low-phosphorous copper (DLPC) was fabricated by three-layer stack accumulative roll-bonding process. Three sheets of 1 mm in thickness, 30 mm in width and 300 mm in length were stacked up and roll-bonded to thickness of 1 mm by two-pass cold rolling. The bonded sheet was cut in three pieces of same length, then stacked up and roll-bonded to the thickness of 1 mm again. The evolution of nanostructure through thickness with three-layer stack ARB were investigated in detail. It was found that the microstructure has been evolved from a dislocation cell structure to a nano grained structure with the proceeding of ARB cycles. The average grain thickness of 45 μm in initial decreased to 170 nm after 7 cycles of the ARB. The heterogeneity in microstructure through thickness was also largely decreased by the ARB. These results suggest that three-layer stack ARB is an effective process for a formation of nanostructure of DLPC alloy.
通过三层堆叠累积轧制粘结工艺制备了一种纳米结构的低磷脱氧铜（DLPC）。将三张厚度为1mm、宽度为30mm、长度为300mm的板材堆叠起来，通过两道次冷轧使其轧至1mm厚。将粘结后的板材切成三段等长的板材，然后再次堆叠并轧至1mm厚。详细研究了三层堆叠累积轧制粘结过程中纳米结构沿厚度方向的演变。结果发现，随着累积轧制粘结循环次数的增加，微观结构从位错胞状结构演变为纳米晶结构。初始平均晶粒厚度为45μm，经过7次累积轧制粘结循环后降至170nm。累积轧制粘结还大大降低了沿厚度方向微观结构的不均匀性。这些结果表明，三层堆叠累积轧制粘结是形成DLPC合金纳米结构的有效工艺。
