Temasek Laboratories@NTU , 50 Nanyang Avenue , Singapore 639798 , Singapore.
ACS Appl Mater Interfaces. 2018 Mar 21;10(11):9688-9695. doi: 10.1021/acsami.8b01925. Epub 2018 Mar 12.
Vertically aligned carbon nanotube (CNT) arrays have been recognized as promising cushion materials because of their superior thermal stability, remarkable compressibility, and viscoelastic characteristics. However, most of the previously reported CNT arrays still suffer from permanent shape deformation at only moderate compressive strains, which considerably restricts their practical applications. Here, we demonstrate a facile strategy of fabricating supercompressible coaxial CNT@graphene (CNT@Gr) arrays by using a two-step route involving encapsulating polymer layers onto plastic CNT arrays and subsequent annealing processes. Notably, the resulting CNT@Gr arrays are able to almost completely recover from compression at a strain of up to 80% and retain ∼80% recovery even after 1000 compression cycles at a 60% strain, demonstrating their excellent compressibility. Furthermore, they possess outstanding strain- and frequency-dependent viscoelastic responses, with storage modulus and damping ratio of up to ∼6.5 MPa and ∼0.19, respectively, which are nearly constant over an exceptionally broad temperature range of -100 to 500 °C in ambient air. These supercompressibility and temperature-invariant viscoelasticity together with facile fabrication process of the CNT@Gr arrays enable their promising multifunctional applications such as energy absorbers, mechanical sensors, and heat exchangers, even in extreme environments.
垂直排列的碳纳米管(CNT)阵列由于其优异的热稳定性、显著的可压缩性和粘弹性特性,已被认为是很有前途的缓冲材料。然而,以前报道的大多数 CNT 阵列仍然在中等压缩应变下就会发生永久的形状变形,这极大地限制了它们的实际应用。在这里,我们展示了一种通过两步法制备超可压缩同轴 CNT@石墨烯(CNT@Gr)阵列的简便策略,该方法包括在塑料 CNT 阵列上包覆聚合物层和随后的退火过程。值得注意的是,所得到的 CNT@Gr 阵列在应变高达 80%的情况下几乎可以完全从压缩中恢复,并且在 60%应变下经过 1000 次压缩循环后仍保持约 80%的恢复率,表现出优异的可压缩性。此外,它们具有出色的应变和频率相关的粘弹性响应,储能模量和阻尼比高达约 6.5 MPa 和 0.19,分别在-100 至 500°C 的宽温度范围内几乎保持不变。这些超压缩性和温度不变的粘弹性以及 CNT@Gr 阵列的简单制造工艺使其有望在极端环境中应用于多功能领域,如能量吸收器、机械传感器和热交换器等。