Venezia Vincent C, Hsiung Alan Chih-Wei, Yang Wu-Zang, Zhang Yuying, Zhao Cheng, Lin Zhiqiang, Grant Lindsay A
OmniVision Technologies, Inc., Santa Clara, CA 95054, USA.
Sensors (Basel). 2018 Feb 24;18(2):667. doi: 10.3390/s18020667.
In this work, OmniVision's second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 technology achieves state-of-the-art low-light image-sensor performance for 1.1, 1.0, and 0.9 µm pixel products. Additional improvements on this technology include less than 100 ppm white-pixel process and a high near-infrared (NIR) QE technology.
在这项工作中,对豪威科技的第二代(Gen2)小像素背照式堆叠技术进行了综述。该技术的关键特性包括混合键合堆叠、更深的背面、深沟槽隔离、新型背面复合金属氧化物栅格以及改进的栅极氧化物质量。这种Gen2技术在1.1微米、1.0微米和0.9微米像素产品上实现了领先的低光图像传感器性能。该技术的其他改进包括低于100 ppm的白像素工艺和高近红外(NIR)量子效率技术。