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在铜离子(Cu2+)存在的情况下,抗坏血酸诱导的DNA损伤。

DNA damage induced by ascorbate in the presence of Cu2+.

作者信息

Kobayashi S, Ueda K, Morita J, Sakai H, Komano T

机构信息

Department of Agricultural Chemistry, Kyoto University, Japan.

出版信息

Biochim Biophys Acta. 1988 Jan 25;949(1):143-7. doi: 10.1016/0167-4781(88)90065-6.

Abstract

DNA damage induced by ascorbate in the presence of Cu2+ was investigated by use of bacteriophage phi X174 double-stranded supercoiled DNA and linear restriction fragments as substrates. Single-strand cleavage was induced when supercoiled DNA was incubated with 5 microM-10 mM ascorbate and 50 microM Cu2+ at 37 degrees C for 10 min. The induced DNA damage was analyzed by sequencing of fragments singly labeled at their 5'- or 3'-end. DNA was cleaved directly and almost uniformly at every nucleotide by ascorbate and Cu2+. Piperidine treatment after the reaction showed that ascorbate and Cu2+ induced another kind of DNA damage different from the direct cleavage. The damage proceeded to DNA cleavage by piperidine treatment and was sequence-specific rather than random. These results indicate that ascorbate induces two classes of DNA damage in the presence of Cu2+, one being direct strand cleavage, probably via damage to the DNA backbone, and the other being a base modification labile to alkali treatment. These two classes of DNA damage were inhibited by potassium iodide, catalase and metal chelaters, suggesting the involvement of radicals generated from ascorbate hydroperoxide.

摘要

利用噬菌体φX174双链超螺旋DNA和线性限制片段作为底物,研究了在Cu2+存在下抗坏血酸诱导的DNA损伤。当超螺旋DNA与5μM - 10 mM抗坏血酸和50μM Cu2+在37℃孵育10分钟时,诱导了单链切割。通过对在其5'或3'末端单标记的片段进行测序来分析诱导的DNA损伤。抗坏血酸和Cu2+直接且几乎均匀地在每个核苷酸处切割DNA。反应后用哌啶处理表明,抗坏血酸和Cu2+诱导了另一种不同于直接切割的DNA损伤。这种损伤通过哌啶处理导致DNA切割,并且是序列特异性的而非随机的。这些结果表明,在Cu2+存在下抗坏血酸诱导了两类DNA损伤,一类是直接链切割,可能是通过对DNA主链的损伤,另一类是对碱处理不稳定的碱基修饰。这两类DNA损伤被碘化钾、过氧化氢酶和金属螯合剂抑制,表明抗坏血酸氢过氧化物产生的自由基参与其中。

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