Choi Sukhoon, Park Sungjin, So Daesup, Huh Hoon
J Nanosci Nanotechnol. 2017 Apr;17(4):2541-544. doi: 10.1166/jnn.2017.13344.
High integration of electronic chip not only improved the electronic device’s efficiency, but also left the need to stop emitting heat. Thermal interface material (TIM) has been proposed to solve this problem. Traditionally, a large amount of high thermal conductive materials (such as Cu, Al or AlN) was added for better thermal conductivity, which caused undesirable weight-increasing and property-sacrificing. Graphene has great thermal conductivity and mechanical properties. Furthermore, owing to its low density, it is possible to make a lot of TIM even with a small amount. Being composited with PU, it can be an enhanced thermal conductive adhesive. Otherwise, amine compound is considered to be applicable as both a chain extender of PU and a reducing agent of Graphene oxide (GO). In this work, we synthesized PU-GO composite by chemical reaction of NCO and GO. We examined the effects of various amine compounds on chemical and physical properties of GO and PU-GO composite. Adhesion and thermal properties were also studied.
电子芯片的高度集成不仅提高了电子设备的效率，还带来了散热的需求。人们提出了热界面材料（TIM）来解决这个问题。传统上，为了获得更好的热导率，会添加大量高导热材料（如铜、铝或氮化铝），这导致了不理想的重量增加和性能牺牲。石墨烯具有出色的热导率和机械性能。此外，由于其低密度，即使使用少量的石墨烯也有可能制备大量的热界面材料。与聚氨酯（PU）复合后，它可以成为一种增强型导热粘合剂。否则，胺化合物被认为既可以作为PU的扩链剂，又可以作为氧化石墨烯（GO）的还原剂。在这项工作中，我们通过NCO与GO的化学反应合成了PU-GO复合材料。我们研究了各种胺化合物对GO和PU-GO复合材料化学和物理性质的影响。还研究了其粘附性和热性能。
