Dai Wen, Ma Tengfei, Yan Qingwei, Gao Jingyao, Tan Xue, Lv Le, Hou Hao, Wei Qiuping, Yu Jinhong, Wu Jianbo, Yao Yagang, Du Shiyu, Sun Rong, Jiang Nan, Wang Yan, Kong Jing, Wong Chingping, Maruyama Shigeo, Lin Cheng-Te
Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies , Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences , Ningbo 315201 , China.
Center of Materials Science and Optoelectronics Engineering , University of Chinese Academy of Sciences , Beijing 100049 , China.
ACS Nano. 2019 Oct 22;13(10):11561-11571. doi: 10.1021/acsnano.9b05163. Epub 2019 Sep 26.
Along with the technology evolution for dense integration of high-power, high-frequency devices in electronics, the accompanying interfacial heat transfer problem leads to urgent demands for advanced thermal interface materials (TIMs) with both high through-plane thermal conductivity and good compressibility. Most metals have satisfactory thermal conductivity but relatively high compressive modulus, and soft silicones are typically thermal insulators (0.3 W m K). Currently, it is a great challenge to develop a soft material with the thermal conductivity up to metal level for TIM application. This study solves this problem by constructing a graphene-based microstructure composed of mainly vertical graphene and a thin cap of horizontal graphene layers on both the top and bottom sides through a mechanical machining process to manipulate the stacked architecture of conventional graphene paper. The resultant graphene monolith has an ultrahigh through-plane thermal conductivity of 143 W m K, exceeding that of many metals, and a low compressive modulus of 0.87 MPa, comparable to that of silicones. In the actual TIM performance measurement, the system cooling efficiency with our graphene monolith as TIM is 3 times as high as that of the state-of-the-art commercial TIM, demonstrating the superior ability to solve the interfacial heat transfer issues in electronic systems.
随着电子领域高功率、高频器件密集集成技术的发展，随之而来的界面传热问题使得对兼具高面内热导率和良好压缩性的先进热界面材料（TIMs）的需求变得迫切。大多数金属具有令人满意的热导率，但压缩模量相对较高，而软质硅酮通常是热绝缘体（0.3 W m K）。目前，开发一种热导率达到金属水平的软质材料用于TIM应用是一项巨大的挑战。本研究通过机械加工工艺构建一种基于石墨烯的微观结构来解决这一问题，该微观结构主要由垂直排列的石墨烯以及顶部和底部两侧的水平石墨烯薄层帽组成，以此来操控传统石墨烯纸的堆叠结构。所得的石墨烯整体材料具有143 W m K的超高面内热导率，超过了许多金属，并且压缩模量低至0.87 MPa，与硅酮相当。在实际的TIM性能测量中，以我们的石墨烯整体材料作为TIM的系统冷却效率是最先进的商用TIM的3倍，这表明其在解决电子系统界面传热问题方面具有卓越能力。
