Zhang Fenghua, Shi Zheng, Gao Xumin, Qin Chuan, Zhang Shuai, Jiang Yan, Wu Fan, Wang Yongjin
Opt Lett. 2018 Apr 15;43(8):1874-1877. doi: 10.1364/OL.43.001874.
An on-chip multicomponent system is implemented on a III-nitride-on-silicon platform by integrating a transmitter, InGaN waveguide, InGaN directional coupler, and receivers onto a single chip. The transmitter and the receiver share an identical InGaN/GaN multiple-quantum-well (MQW) diode structure and are produced by using the same wafer-level process flow. The receiver sensitively responds to the short-wavelength half of the emission spectrum of the transmitter, thus realizing the multicomponent system with the capability for inplane light communication. A SiO isolation layer is employed to decrease the p-n junction capacitance, thus improving the modulation rate without modifying the MQW structure. The wire-bonded monolithic multicomponent system experimentally demonstrates inplane data transmission at 80 Mbps and spatial light communication at 100 Mbps, paving the way for diverse applications from on-chip power monitoring to inplane light communication in the visible light spectrum.
通过将发射器、氮化铟镓波导、氮化铟镓定向耦合器和接收器集成到单个芯片上，在硅基氮化镓平台上实现了片上多组件系统。发射器和接收器采用相同的氮化铟镓/氮化镓多量子阱（MQW）二极管结构，并通过相同的晶圆级工艺流程制造。接收器对发射器发射光谱的短波长部分敏感响应，从而实现了具有平面内光通信能力的多组件系统。采用SiO隔离层来降低p-n结电容，从而在不改变MQW结构的情况下提高调制速率。通过引线键合的单片多组件系统在实验中展示了80Mbps的平面内数据传输和100Mbps的空间光通信，为从片上功率监测到可见光谱内平面光通信的各种应用铺平了道路。
