State Key Laboratory of Advanced Technology for Materials Synthesis and Processing , Wuhan University of Technology , Wuhan 430070 , China.
Department of Physics , University of Michigan , Ann Arbor , Michigan 48109 , United States.
ACS Appl Mater Interfaces. 2018 May 9;10(18):15793-15802. doi: 10.1021/acsami.8b00524. Epub 2018 Apr 30.
SnSe is a wide band gap semiconductor ( E = 1.05 eV) with a typical two-dimensional hexagonal crystal structure of the prototype CdI phase, resulting in an intrinsically low thermal conductivity, which is favorable for thermoelectrics. Herein, we reported the remarkable role of Cl doping in SnSe/SnSe nanocomposites. Doping with Cl in the system not only increases the carrier concentration by an order of magnitude, but it also modifies the heterojunction from that of the Schottky junction type (p-n junction) in undoped samples to junctions having an ohmic contact (n-n junction) when the samples are doped with Cl, increasing their carrier mobility in the process. On account of the simultaneously boosted carrier concentration and carrier mobility upon Cl doping, the electrical conductivity and the power factor are greatly increased. Moreover, the enhanced point defect phonon scattering induced by Cl doping, coupled with the interface phonon scattering, results in a suppression of the thermal conductivity. As a consequence, the maximum ZT value of 0.56 at 773 K is achieved in the 6% Cl-doped SnSe/SnSe nanocomposite measured in the direction parallel to the pressing direction. This is an almost 6 times larger value than that measured on the undoped composite. In addition, unlike the conventional layered compounds (BiTe and SnSe), the ZT value measured parallel to the pressing direction is much higher than the one measured perpendicular to the pressing direction. This study provides a new way for optimizing the thermoelectric properties of materials through interface regulation.
SnSe 是一种宽带隙半导体(E=1.05eV),具有典型的二维六方晶相 CdI 型结构,导致其导热系数本征较低,有利于热电应用。在此,我们报道了 Cl 掺杂在 SnSe/SnSe 纳米复合材料中的显著作用。在该体系中掺杂 Cl 不仅使载流子浓度提高了一个数量级,而且还将异质结从未掺杂样品中的肖特基结型(p-n 结)改变为掺杂 Cl 时的欧姆接触型(n-n 结),从而提高了载流子迁移率。由于 Cl 掺杂同时提高了载流子浓度和载流子迁移率,电导率和功率因子大大提高。此外,Cl 掺杂引起的增强点缺陷声子散射与界面声子散射相结合,导致热导率降低。结果,在沿加压方向测量的 6% Cl 掺杂 SnSe/SnSe 纳米复合材料中,获得了 773K 时 0.56 的最大 ZT 值,比未掺杂复合材料测量的 ZT 值高近 6 倍。此外,与传统的层状化合物(BiTe 和 SnSe)不同,沿加压方向测量的 ZT 值远高于垂直于加压方向测量的 ZT 值。本研究通过界面调控为优化材料的热电性能提供了一种新途径。