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一次性无仪器 DNA 扩增芯片实验室的热分析。

Thermal Analysis of a Disposable, Instrument-Free DNA Amplification Lab-on-a-Chip Platform.

机构信息

Thomas Johann Seebeck Department of Electronics, Tallinn University of Technology, 12616 Tallinn, Estonia.

Selfdiagnostics Deutschland GmbH, 04103 Leipzig, Germany.

出版信息

Sensors (Basel). 2018 Jun 4;18(6):1812. doi: 10.3390/s18061812.

Abstract

Novel second-generation rapid diagnostics based on nucleic acid amplification tests (NAAT) offer performance metrics on par with clinical laboratories in detecting infectious diseases at the point of care. The diagnostic assay is typically performed within a Lab-on-a-Chip (LoC) component with integrated temperature regulation. However, constraints on device dimensions, cost and power supply inherent with the device format apply to temperature regulation as well. Thermal analysis on simplified thermal models for the device can help overcome these barriers by speeding up thermal optimization. In this work, we perform experimental thermal analysis on the simplified thermal model for our instrument-free, single-use LoC NAAT platform. The system is evaluated further by finite element modelling. Steady-state as well as transient thermal analysis are performed to evaluate the performance of a self-regulating polymer resin heating element in the proposed device geometry. Reaction volumes in the target temperature range of the amplification reaction are estimated in the simulated model to assess compliance with assay requirements. Using the proposed methodology, we demonstrated our NAAT device concept capable of performing loop-mediated isothermal amplification in the 20⁻25 °C ambient temperature range with 32 min total assay time.

摘要

基于核酸扩增检测(NAAT)的新型第二代快速诊断方法在即时护理点检测传染病方面提供了与临床实验室相当的性能指标。诊断检测通常在带有集成温度调节的片上实验室(LoC)组件内进行。然而,设备尺寸、成本和电源供应方面的限制也适用于温度调节。通过加快热优化,简化设备热模型的热分析可以帮助克服这些障碍。在这项工作中,我们对我们无仪器、一次性使用的 LoC NAAT 平台的简化热模型进行了实验热分析。通过有限元建模进一步评估了该系统。进行稳态和瞬态热分析,以评估在提出的设备几何形状中自调节聚合物树脂加热元件的性能。在模拟模型中估计了扩增反应的目标温度范围内的反应体积,以评估与测定要求的一致性。使用所提出的方法,我们证明了我们的 NAAT 设备概念能够在 20-25°C 环境温度范围内进行环介导等温扩增,总测定时间为 32 分钟。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a68a/6021835/982174db9c15/sensors-18-01812-g001.jpg

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