Ma Yang, Ajayan Pulickel M, Yang Shubin, Gong Yongji
School of Materials Science and Engineering, Beihang University, Beijing, 100191, China.
Department of Materials Science and NanoEngineering, Rice University, Houston, TX, 77005, USA.
Small. 2018 Sep;14(38):e1801606. doi: 10.1002/smll.201801606. Epub 2018 Aug 2.
Recent progress in the methods of integration of 2D materials is reviewed. Integrated 2D circuits are one of the most promising candidates for advanced electronics and flexible devices. Specifically, methods such as mechanical transfer, chemical vapor deposition growth, high temperature conversion, phase engineering, surface doping, electrostatic doping, and so on to fabricate 2D heterostructures are discussed in detail. Applications of these integrated 2D heterostructures in p-n junctions, ohmic contact, high-performance transistors, and phototransistors are also highlighted. Finally, challenges and opportunities of methods to integrate 2D materials are proposed.
综述了二维材料集成方法的最新进展。集成二维电路是先进电子学和柔性器件最有前景的候选者之一。具体详细讨论了诸如机械转移、化学气相沉积生长、高温转换、相工程、表面掺杂、静电掺杂等制备二维异质结构的方法。还重点介绍了这些集成二维异质结构在p-n结、欧姆接触、高性能晶体管和光电晶体管中的应用。最后,提出了二维材料集成方法面临的挑战和机遇。