Rau Daniel A, Herzberger Jana, Long Timothy E, Williams Christopher B
ACS Appl Mater Interfaces. 2018 Oct 17;10(41):34828-34833. doi: 10.1021/acsami.8b14584. Epub 2018 Oct 8.
All-aromatic polyimides have degradation temperatures above 500 °C, excellent mechanical strength, and chemical resistance, and are thus ideal polymers for high-temperature applications. However, their all-aromatic structure impedes additive manufacturing (AM) because of the lack of melt processability and insolubility in organic solvents. Recently, our group demonstrated the design of UV-curable polyamic acids (PAA), the precursor of polyimides, to enable their processing using vat photopolymerization AM. This work leverages our previous synthetic strategy and combines it with the high solution viscosity of nonisolated PAA to yield suitable UV-curable inks for UV-assisted direct ink write (UV-DIW). UV-DIW enabled the design of complex three-dimensional structures comprising of thin features, such as truss structures. Dynamic mechanical analysis of printed and imidized specimens confirmed the thermomechanical properties typical of all-aromatic polyimides, showing a storage modulus above 1 GPa up to 400 °C. Processing polyimide precursors via DIW presents opportunity for multimaterial printing of multifunctional components, such as three-dimensional integrated electronics.
全芳香族聚酰亚胺具有高于500°C的降解温度、优异的机械强度和耐化学性,因此是高温应用的理想聚合物。然而,由于缺乏熔体加工性且在有机溶剂中不溶,它们的全芳香族结构阻碍了增材制造(AM)。最近,我们团队展示了可紫外光固化的聚酰胺酸(PAA)的设计,聚酰胺酸是聚酰亚胺的前体,可通过光固化立体光刻增材制造工艺对其进行加工。这项工作利用了我们之前的合成策略,并将其与非孤立PAA的高溶液粘度相结合,以生产适用于紫外辅助直接墨水书写(UV-DIW)的可紫外光固化油墨。UV-DIW能够设计出由薄特征组成的复杂三维结构,如桁架结构。对印刷和酰亚胺化试样的动态力学分析证实了全芳香族聚酰亚胺典型的热机械性能,在高达400°C的温度下储能模量高于1 GPa。通过直接墨水书写加工聚酰亚胺前体为多功能组件的多材料打印提供了机会,例如三维集成电子器件。