Li Keda, Ding Jinghong, Guo Yuxiong, Wu Hongchao, Wang Wenwen, Ji Jiaqi, Pei Qi, Gong Chenliang, Ji Zhongying, Wang Xiaolong
State Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, China.
State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China.
Polymers (Basel). 2022 Jun 30;14(13):2669. doi: 10.3390/polym14132669.
The three-dimensional (3D) printing of a SiO-filled thermosetting polyimide (SiO@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter. The composite ink consists of phenylethynyl-terminated PAA and silica nanoparticles, where the SiO nanoparticles serve as the rheology modifier that is necessary for the DIW technique to obtain self-supporting feedstock during 3D printing and the reinforcement filler that is used to enhance the performance of the final composite. As a result, printed parts with complex geometry and robust thermal stability are obtained. Due to the extrusion-based DIW technique, the printed structures exhibit anisotropic mechanical strength that highly depends on printing roads. This simple and convenient means of realizing 3D structures of thermosetting polyimides is a promising strategy in aerospace and other fields.
通过聚酰胺酸（PAA）复合墨水的直接墨水书写（DIW）及其后的热处理，实现了具有优异性能的SiO填充热固性聚酰亚胺（SiO@TSPI）复合材料的三维（3D）打印。复合墨水由苯基乙炔基封端的PAA和二氧化硅纳米颗粒组成，其中SiO纳米颗粒用作流变改性剂，这是DIW技术在3D打印过程中获得自支撑原料所必需的，同时也是用于增强最终复合材料性能的增强填料。结果，获得了具有复杂几何形状和强大热稳定性的打印部件。由于基于挤出的DIW技术，打印结构表现出高度依赖于打印路径的各向异性机械强度。这种实现热固性聚酰亚胺3D结构的简单便捷方法是航空航天等领域中一种很有前景的策略。
