School of Information and Control Engineering, Xi'an University of Architecture and Technology, Xi'an, 710055, People's Republic of China.
Xidian University, Xi'an, Xi'an, 710071, People's Republic of China.
Chemphyschem. 2019 Jan 7;20(1):128-133. doi: 10.1002/cphc.201800903. Epub 2018 Nov 28.
Utilizing first principle calculations, a novel Si silicon allotrope in the I4 /amd space group with tetragonal symmetry (denoted as t-Si below) is proposed in this work. In addition, also its structural, anisotropic mechanical, and electronic properties along with its minimum thermal conductivity κ were predicted. The mechanical and thermodynamic stability of t-Si were evaluated by means of elastic constants and phonon spectra. The electronic band structure indicates that t-Si is an indirect band gap semiconductor with a band gap: 0.67 eV (primitive cell) compared to a direct band gap of 0.70 eV with respect to a conventional cell. The minimum thermal conductivity of t-Si (0.74 W cm K ) is much smaller than that of diamond silicon (1.13 W cm K ). Therefore, Si-Ge alloys in the I4 /amd space group are potential thermoelectric materials.
本工作利用第一性原理计算,提出了一种具有四方对称性的 I4 /amd 空间群的新型硅同素异形体(下文简称 t-Si)。此外,还预测了其各向异性力学和电子性质以及最低热导率κ。通过弹性常数和声子谱评估了 t-Si 的力学和热力学稳定性。电子能带结构表明,t-Si 是间接带隙半导体,带隙为 0.67 eV(原胞),相比之下,常规胞的带隙为 0.70 eV,为直接带隙。t-Si 的最低热导率(0.74 W cm K )远小于金刚石硅(1.13 W cm K )。因此,I4 /amd 空间群中的 Si-Ge 合金是潜在的热电材料。