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Ti40Zr25B0.2Cu非晶态钎料钎焊Si₃N₄陶瓷/Cu/304不锈钢的界面微观结构与性能

Interfacial Microstructure and Properties of Si₃N₄ Ceramics/Cu/304 Stainless Steel Brazed by Ti40Zr25B0.2Cu Amorphous Solder.

作者信息

Xu Xiangping, Wang Yi, Zou Jiasheng, Xia Chunzhi

机构信息

School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China.

出版信息

Materials (Basel). 2018 Nov 9;11(11):2226. doi: 10.3390/ma11112226.

DOI:10.3390/ma11112226
PMID:30423903
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6265858/
Abstract

Si₃N₄ ceramics and 304 stainless steel were brazed by Ti40Zr25B0.2Cu amorphous solder, and the interfacial microstructure of brazed joint Si₃N₄ ceramics/Ti40Zr25B0.2Cu/Cu/Ti40Zr25B0.2Cu/304 stainless steel was analyzed. The mechanical properties of the brazed joint were overtly affected by the brazing temperature and Cu foil thickness. The results revealed that the interface structure of the brazed joint might be 304 stainless steel/FeTi/Cu-Zr+Cu-Ti+Fe-Ti/Cu(s,s)/Cu-Zr+Cu-Ti+Fe-Ti/Ti-Si+Zr-Si/TiN/Si₃N₄ ceramics. The four-point bending strength of the brazed joint decreased sharply as the brazing temperature increased and reached a maximum of 76 MPa at 1223 K. Furthermore, as the Cu foil thickness was increased from 500 μm to 1000 μm, the joint strength rose to 90 MPa at 1223 K.

摘要

采用Ti40Zr25B0.2Cu非晶态焊料对Si₃N₄陶瓷与304不锈钢进行钎焊，并对钎焊接头Si₃N₄陶瓷/Ti40Zr25B0.2Cu/Cu/Ti40Zr25B0.2Cu/304不锈钢的界面微观结构进行了分析。钎焊温度和铜箔厚度对钎焊接头的力学性能有显著影响。结果表明，钎焊接头的界面结构可能为304不锈钢/FeTi/Cu-Zr+Cu-Ti+Fe-Ti/Cu（固溶体）/Cu-Zr+Cu-Ti+Fe-Ti/Ti-Si+Zr-Si/TiN/Si₃N₄陶瓷。随着钎焊温度升高，钎焊接头的四点弯曲强度急剧下降，在1223K时达到最大值76MPa。此外，当铜箔厚度从500μm增加到1000μm时，在1223K时接头强度升至90MPa。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/39a74db97e1b/materials-11-02226-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/55e4519cf6e7/materials-11-02226-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/b8197d793968/materials-11-02226-g002a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/d150e9fbe2e2/materials-11-02226-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/b47375dee5ea/materials-11-02226-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/c4d61e9835a1/materials-11-02226-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/670d75ac5aea/materials-11-02226-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/66028ec00a73/materials-11-02226-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/39a74db97e1b/materials-11-02226-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/55e4519cf6e7/materials-11-02226-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/b8197d793968/materials-11-02226-g002a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/d150e9fbe2e2/materials-11-02226-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/b47375dee5ea/materials-11-02226-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/c4d61e9835a1/materials-11-02226-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/670d75ac5aea/materials-11-02226-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/66028ec00a73/materials-11-02226-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/c37f/6265858/39a74db97e1b/materials-11-02226-g008.jpg

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