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光纤上的近场耦合可积二维铟硒光电探测器

Near-Field Coupled Integrable Two-Dimensional InSe Photosensor on Optical Fiber.

作者信息

Jin Zehua, Ye Fan, Zhang Xiang, Jia Shuai, Dong Liangliang, Lei Sidong, Vajtai Robert, Robinson Jacob T, Lou Jun, Ajayan Pulickel M

机构信息

Department of Materials Science and NanoEngineering , Rice University , Houston , Texas 77005 , United States.

Department of Electrical and Computer Engineering , Rice University , Houston , Texas 77005 , United States.

出版信息

ACS Nano. 2018 Dec 26;12(12):12571-12577. doi: 10.1021/acsnano.8b07159. Epub 2018 Dec 3.

DOI:10.1021/acsnano.8b07159
PMID:30481003
Abstract

Two-dimensional (2D) van der Waals layered materials possess innate advantages as integrable sensors, due to their thinness, flexibility, and sensitivity. They can be seamlessly integrated onto surfaces with different geometries where detection for near-field signal is desired. In this study, we develop a device transfer technique to integrate device assemblies based on 2D materials onto an arbitrary smooth surface. Such technique utilizes a sacrificial polymer underlayer and achieves clean and nondestructive full device transfer. For demonstration, we transferred a complete 2D multilayer InSe photodetector device onto a stripped optical fiber. Due to the extreme vicinity of the 2D photodetector with the fiber core, the device can effectively couple with the evanescent field and accurately detect information transmitted inside the optical fiber. In addition, these super thin flexible device assemblies can be integrated onto the fibers themselves to non-invasively monitor the optical fiber performance. The demonstration of optically coupled, conformal 2D devices on substrates of different form factors can enable a variety of near-field optical and sensing applications.

摘要

二维(2D)范德华层状材料作为可集成传感器具有先天优势,这得益于它们的薄度、柔韧性和灵敏度。它们可以无缝集成到需要检测近场信号的具有不同几何形状的表面上。在本研究中,我们开发了一种器件转移技术,将基于二维材料的器件组件集成到任意光滑表面上。这种技术利用一种牺牲聚合物底层,实现了器件的完整无损转移。为了进行演示,我们将一个完整的二维多层InSe光电探测器器件转移到一根剥去外皮的光纤上。由于二维光电探测器与光纤纤芯极为接近,该器件能够有效地与倏逝场耦合,并准确检测光纤内部传输的信息。此外,这些超薄柔性器件组件可以集成到光纤自身上,以非侵入方式监测光纤性能。在不同外形因子的基板上展示光耦合、共形二维器件能够实现各种近场光学和传感应用。

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