Li Wanli, Yang Yang, Zhang Bowen, Li Lingying, Liu Guiming, Li Cai-Fu, Jiu Jinting, Suganuma Katsuaki
Department of Adaptive Machine Systems, Graduate School of Engineering , Osaka University , Yamadaoka 2-1 , Suita , Osaka 565-0871 , Japan.
The Institute of Scientific and Industrial Research (ISIR) , Osaka University , Mihogaoka 8-1 , Ibaraki , Osaka 567-0047 , Japan.
ACS Appl Mater Interfaces. 2019 Jan 16;11(2):2140-2148. doi: 10.1021/acsami.8b18670. Epub 2019 Jan 3.
Although stretchable transparent conductors, stemmed from the strategies of both conductive composite and structural design of nonstretchable conductors, have been extensively studied, these conductors either suffer from low stretchability or require a complex fabrication process, which drastically limits their practical applications. Here, we propose a novel strategy combining the design of substrates and a simple template-assisted transfer printing process to fabricate three-dimensional (3D) transparent conductors. The strategy not only eliminates the complex and costly fabrication processes but it also endows conductors with high stretchability and long-term stability, thanks to the controllable strain distribution as well as the seamless connection between the conductor layer and the substrate. These newly designed 3D conductors achieve a low sheet resistance of 1.0 Ω/sq with a high transmittance of above 85% and remain stable without obvious resistance change during 1000 stretching-relaxation cycles until 60% strain, which are superior to most reported conductors. A large-area stretchable heater based on the 3D conductor realizes the temperature fluctuation below 10% even under a large strain, thus showing huge application prospects in the field of wearable healthcare electronics. The simple solution-processed fabrication method and high performance such as stretchability and low resistance change over a large strain range promote the practical applications of these newly designed 3D conductors.
尽管源于导电复合材料策略和不可拉伸导体结构设计的可拉伸透明导体已得到广泛研究，但这些导体要么拉伸性低，要么需要复杂的制造工艺，这极大地限制了它们的实际应用。在此，我们提出一种结合基板设计和简单模板辅助转移印刷工艺的新策略来制造三维（3D）透明导体。该策略不仅消除了复杂且昂贵的制造工艺，还由于可控的应变分布以及导体层与基板之间的无缝连接，赋予导体高拉伸性和长期稳定性。这些新设计的3D导体实现了1.0 Ω/sq的低方阻，具有高于85%的高透光率，并且在1000次拉伸 - 松弛循环直至60%应变的过程中保持稳定，无明显电阻变化，优于大多数已报道的导体。基于3D导体的大面积可拉伸加热器即使在大应变下也能实现温度波动低于10%，从而在可穿戴医疗电子领域展现出巨大的应用前景。简单的溶液处理制造方法以及诸如在大应变范围内的拉伸性和低电阻变化等高性能促进了这些新设计的3D导体的实际应用。
