Green Marques Daniel, Alhais Lopes Pedro, T de Almeida Anibal, Majidi Carmel, Tavakoli Mahmoud
Institute of Systems and Robotics, University of Coimbra, Rua Silvio Lima-Polo II, 3030-290 Coimbra, Portugal.
Lab Chip. 2019 Feb 26;19(5):897-906. doi: 10.1039/c8lc01093e.
We tackle two well-known problems in the fabrication of stretchable electronics: interfacing soft circuit wiring with silicon chips and fabrication of multi-layer circuits. We demonstrate techniques that allow integration of embedded flexible printed circuit boards (FPCBs) populated with microelectronics into soft circuits composed of liquid metal (LM) interconnects. These methods utilize vertical interconnect accesses (VIAs) that are produced by filling LM alloy into cavities formed by laser ablation. The introduced technique is versatile, easy to perform, clean-room free, and results in reliable multi-layer stretchable hybrid circuits that can withstand over 80% of strain. We characterize the fabrication parameters of such VIAs and demonstrated several applications, including a stretchable touchpad and pressure detection film, and an all-integrated multi-layer electromyography (EMG) circuit patch with five active layers including acquisition electrodes, on-board processing and Bluetooth communication modules.
软电路布线与硅芯片的接口以及多层电路的制造。我们展示了一些技术，这些技术允许将填充有微电子器件的嵌入式柔性印刷电路板（FPCB）集成到由液态金属（LM）互连组成的软电路中。这些方法利用通过将LM合金填充到激光烧蚀形成的腔体中而产生的垂直互连通道（VIA）。所引入的技术用途广泛、易于执行、无需洁净室，并且能够制造出可靠的多层可拉伸混合电路，该电路能够承受超过80%的应变。我们对这种VIA的制造参数进行了表征，并展示了几种应用，包括可拉伸触摸板和压力检测薄膜，以及一个全集成的多层肌电图（EMG）电路贴片，该贴片具有五个有源层，包括采集电极、板载处理和蓝牙通信模块。
