Cho Hanlyun, Godinez Juan, Han Jun Sae, Fadda Dani, You Seung Mun, Lee Jungho, Park Seong Jin
Department of Mechanical Engineering, Pohang University of Science and Technology, 77 Cheongam-ro, Nam-gu, Pohang, Gyeongsangbuk-do 37673, Korea.
Department of Mechanical Engineering, The University of Texas at Dallas, 800 W. Campbell Rd., Richardson, TX 75080, USA.
Materials (Basel). 2019 Feb 7;12(3):507. doi: 10.3390/ma12030507.
In this study, two kinds of copper micro-patterned surfaces with different heights were fabricated by using a powder injection molding (PIM) process. The micro-pattern's size was 100 μm, and the gap size was 50 μm. The short micro-pattern's height was 100 μm, and the height of the tall one was 380 μm. A copper powder and wax-polymer-based binder system was used to fabricate the micro-patterned surfaces. The critical heat flux (CHF) and heat transfer coefficient (HTC) during pool-boiling tests were measured with the micro-patterned surfaces and a reference plain copper surface. The CHF of short and tall micro-patterned surfaces were 1434 and 1444 kW/m², respectively, and the plain copper surface's CHF was 1191 kW/m². The HTC of the plain copper surface and the PIM surface with short and tall micro-patterned surfaces were similar in value up to a heat flux 1000 kW/m². Beyond that value, the plain surface quickly reached its CHF, while the HTC of the short micro-patterned surface achieved higher values than that of the tall micro-patterned surface. At CHF, the maximum values of HTC for the short micro-pattern, tall micro-pattern, and the plain copper surface were 68, 58, and 57 kW/m² K.
在本研究中，采用粉末注射成型（PIM）工艺制备了两种具有不同高度的铜微图案表面。微图案的尺寸为100μm，间隙尺寸为50μm。短微图案的高度为100μm，高微图案的高度为380μm。使用铜粉和蜡基聚合物粘结剂体系来制备微图案表面。在池沸腾试验中，用微图案表面和参考平面铜表面测量了临界热流密度（CHF）和传热系数（HTC）。短微图案表面和高微图案表面的CHF分别为1434和1444kW/m²，平面铜表面的CHF为1191kW/m²。在热流密度达到1000kW/m²之前，平面铜表面和带有短微图案及高微图案的PIM表面的HTC值相近。超过该值后，平面表面迅速达到其CHF，而短微图案表面的HTC值高于高微图案表面的值。在CHF时，短微图案、高微图案和平面铜表面的HTC最大值分别为68、58和57kW/m²·K。
