Nothdurft Philipp, Riess Gisbert, Kern Wolfgang
Chair of Chemistry of Polymeric Materials, Montanuniversität Leoben, A-8700 Leoben, Austria.
Polymer Competence Center Leoben GmbH, Roseggerstraße 12, A-8700 Leoben, Austria.
Materials (Basel). 2019 Feb 12;12(3):550. doi: 10.3390/ma12030550.
Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
印刷电路板（PCBs）在电子领域有广泛应用，用于电信号传输。对于多层积层板，薄铜箔与环氧预浸料交替层压在一起。铜与环氧复合材料之间的粘合通过基于机械互锁或化学键合的技术实现，然而，对于未来的发展而言，了解这些材料之间的失效机制至关重要。在文献中，报道了各种导致铜与环氧树脂之间附着力丧失的界面失效情况。本综述旨在概述常见的耦合技术和可能的失效机制。所综述的信息进而可促成新策略的开发，提高铜/环氧接头的粘合强度，从而为未来的印刷电路板制造奠定基础。
