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一种具有氢键和二氧化硅粒子的自修复及抑制电树的环氧复合材料。

A Self-Healing and Electrical-Tree-Inhibiting Epoxy Composite with Hydrogen-Bonds and SiO₂ Particles.

作者信息

Bian Wancong, Wang Wenxuan, Yang Ying

机构信息

Department of Electrical Engineering, Tsinghua University, Beijing 100084, China.

出版信息

Polymers (Basel). 2017 Sep 8;9(9):431. doi: 10.3390/polym9090431.

DOI:10.3390/polym9090431
PMID:30965734
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6418971/
Abstract

Electrical tree growth in the insulation material is a main factor limiting the lifespan of insulation. A new method of increasing the durability and reliability of polymer dielectrics has been proposed by designing a three-phase electrical self-healing composite. SiO₂ micro and nano particles were loaded in the sample which can improve the resistance to electrical tree breakdown. Materials with hydrogen bonds were synthesized and added into epoxy matrix to make the composite self-healable. It is found that both SiO₂ and hydrogen-bonding self-healing material (HSM) can inhibit the electrical trees. Besides the self-healing behavior at the macro level, the incorporation of HSM can also make the micro defects such as electrical tree channel self-healable. The electrical self-healing composite will find a wide application in the field of electronic and electrical engineering.

摘要

绝缘材料中的电树生长是限制绝缘寿命的主要因素。通过设计一种三相电自修复复合材料,提出了一种提高聚合物电介质耐久性和可靠性的新方法。在样品中加载了SiO₂微米和纳米颗粒,这可以提高对电树击穿的抗性。合成了具有氢键的材料并将其添加到环氧基体中,以使复合材料具有自修复能力。研究发现,SiO₂和氢键自修复材料(HSM)都能抑制电树。除了宏观层面的自修复行为外,HSM的加入还能使诸如电树通道等微观缺陷实现自修复。这种电自修复复合材料将在电子和电气工程领域得到广泛应用。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/26eea7ead507/polymers-09-00431-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/fc2a8f012556/polymers-09-00431-g001a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/0842b7545f80/polymers-09-00431-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/860eeb8d51b4/polymers-09-00431-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/300f1991e265/polymers-09-00431-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/61021492e5c9/polymers-09-00431-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/d6fa8893d8ad/polymers-09-00431-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/04d1feeddfa9/polymers-09-00431-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/108ef15c7d0e/polymers-09-00431-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/26eea7ead507/polymers-09-00431-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/fc2a8f012556/polymers-09-00431-g001a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/0842b7545f80/polymers-09-00431-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/860eeb8d51b4/polymers-09-00431-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/300f1991e265/polymers-09-00431-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/61021492e5c9/polymers-09-00431-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/d6fa8893d8ad/polymers-09-00431-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/04d1feeddfa9/polymers-09-00431-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/108ef15c7d0e/polymers-09-00431-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/918d/6418971/26eea7ead507/polymers-09-00431-g009.jpg

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