Peng R, Qu Y, Hao J, Pan H, Niu J, Jiang J
School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing, China.
Chinese Academy of Sciences, Institute of Microelectronics of CAS, Beijing, China.
J Microsc. 2019 Jun;274(3):139-149. doi: 10.1111/jmi.12792. Epub 2019 May 3.
High-throughput through-focus scanning optical microscopy (TSOM) involves defocusing along the optical axis and capturing a series of defocus images and is useful in optical nanoscale measurement. However, TSOM is usually affected by its optical and mechanical noises. In this study, the issue of sensitivity and application in three-dimensional (3D) multiple parameter measurement of TSOM is investigated. First, a TSOM system with objective scanning and its relative simulation algorithm are proposed. Second, based upon the system and algorithm, an experiment on an isolated Au line is performed and the corresponding matching library is established. Comparing the experimental TSOM image and simulated TSOM images of the library, 3D multiple parameter results of the Au line are extracted. Third, the precision of the system is analysed through a fidelity test particular for through-focus images. According to this study, the system is robust to the optical and mechanical noises and hence could be useful in 3D multiple parametric measurement and high-volume nanomanufacturing.
高通量透焦扫描光学显微镜（TSOM）涉及沿光轴离焦并捕获一系列离焦图像，在光学纳米级测量中很有用。然而，TSOM通常会受到其光学和机械噪声的影响。在本研究中，研究了TSOM在三维（3D）多参数测量中的灵敏度和应用问题。首先，提出了一种具有物镜扫描的TSOM系统及其相关模拟算法。其次，基于该系统和算法，对一条孤立的金线进行了实验，并建立了相应的匹配库。通过比较库中的实验TSOM图像和模拟TSOM图像，提取了金线的三维多参数结果。第三，通过针对透焦图像的保真度测试来分析系统的精度。根据本研究，该系统对光学和机械噪声具有鲁棒性，因此可用于三维多参数测量和大规模纳米制造。
