Kim Young Woong, Woo Dong Gon, Ahn Jinho
Division of Materials Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea.
J Nanosci Nanotechnol. 2019 Oct 1;19(10):6463-6467. doi: 10.1166/jnn.2019.17072.
For the successful implementation of extreme ultraviolet lithography (EUVL) into high-volume manufacturing, the development of a novel structure mask for resolution improvement is essential. In this paper, coherent scattering microscopy (CSM) is introduced as an actinic metrology technique based on coherent diffractive imaging (CDI) for EUV mask development. CDI reconstructs the mask image using diffraction patterns from the mask through mathematical calculations. CSM can analyze details of an EUV mask such as its diffraction efficiency and phase information.
为了将极紫外光刻(EUVL)成功应用于大规模制造,开发一种用于提高分辨率的新型结构掩模至关重要。本文介绍了相干散射显微镜(CSM),它是一种基于相干衍射成像(CDI)的用于EUV掩模开发的光化学计量技术。CDI通过数学计算利用掩模的衍射图案重建掩模图像。CSM可以分析EUV掩模的细节,如衍射效率和相位信息。