Lim Dong Un, Choi Seungbeom, Kim Seongchan, Choi Young Jin, Lee Sungjoo, Kang Moon Sung, Kim Yong-Hoon, Cho Jeong Ho
Department of Chemical and Biomolecular Engineering , Yonsei University , Seoul 03722 , Korea.
Department of Chemical and Biomolecular Engineering , Sogang University , Seoul 04107 , Korea.
ACS Nano. 2019 Jul 23;13(7):8213-8221. doi: 10.1021/acsnano.9b03428. Epub 2019 Jul 5.
In this study, we fabricated an array of all-inkjet-printed vertical Schottky barrier (SB) transistors and various logic gates on a large-area substrate. All of the electronic components, including the indium-gallium-zinc-oxide (IGZO) semiconductor, reduced graphene oxide (rGO), and indium-tin-oxide (ITO) electrodes, and the ion-gel gate dielectric, were directly and uniformly printed onto a 4 in. wafer. The vertical SB transistors had a vertically stacked structure, with the inkjet-printed IGZO semiconductor layer placed between the rGO source electrode and the ITO drain electrode. The ion-gel gate dielectric was also inkjet-printed in a coplanar gate geometry. The channel current was controlled by adjusting the SB height at the rGO/IGZO heterojunction under application of an external gate voltage. The high intrinsic capacitance of the ion-gel gate dielectric facilitated modulation of the SB height at the source/channel heterojunction to around 0.5 eV at a gate voltage lower than 2 V. The resulting vertical SB transistors exhibited a high current density of 2.0 A·cm, a high on-off current ratio of 10, and excellent operational and environmental stabilities. The simple device structure of the vertical SB transistors was beneficial for the fabrication of all-inkjet-printed low-power logic circuits such as the NOT, NAND, and NOR gates on a large-area substrate.
在本研究中,我们在大面积衬底上制造了一系列全喷墨打印的垂直肖特基势垒(SB)晶体管和各种逻辑门。所有电子元件,包括铟镓锌氧化物(IGZO)半导体、还原氧化石墨烯(rGO)和氧化铟锡(ITO)电极,以及离子凝胶栅极电介质,都被直接且均匀地打印到一个4英寸的晶圆上。垂直SB晶体管具有垂直堆叠结构,喷墨打印的IGZO半导体层置于rGO源电极和ITO漏电极之间。离子凝胶栅极电介质也以共面栅极几何结构进行喷墨打印。在施加外部栅极电压时,通过调节rGO/IGZO异质结处的SB高度来控制沟道电流。离子凝胶栅极电介质的高本征电容有助于在低于2 V的栅极电压下将源极/沟道异质结处的SB高度调制到约0.5 eV。由此得到的垂直SB晶体管表现出2.0 A·cm的高电流密度、10的高开/关电流比以及优异的操作和环境稳定性。垂直SB晶体管简单的器件结构有利于在大面积衬底上制造全喷墨打印的低功耗逻辑电路,如非门、与非门和或非门。