Feng Jianrui, Dai Kaida, Zhou Qiang, Xie Jing, Yang Rongjie, Bataev I A, Chen Pengwan
School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, People's Republic of China.
J Phys Condens Matter. 2019 Oct 16;31(41):415403. doi: 10.1088/1361-648X/ab30d7. Epub 2019 Jul 11.
The bonding between copper (Cu) and iron (Fe) to form a bi-layer composite using explosive welding is investigated through molecular dynamics simulation. Three stages in the joining process, including loading, unloading and cooling, are sequentially considered in modelling the formation of the bonding interface. The results demonstrate that three types of bonding interfaces can be obtained, based on whether melting happens. The morphologies and the atomic structures of the three types bonding interfaces in each stage are analyzed. The formation of nanograins near the bonding interface is mainly due to the melting and subsequent cooling process. Atomic simulations of tensile tests reveal that melting is not a necessary factor to form the bonding interface. What's more, depending on whether melting occurs, the joining mechanism can be regarded as pressure welding or fusion-diffusion welding.
通过分子动力学模拟研究了利用爆炸焊接使铜（Cu）与铁（Fe）结合形成双层复合材料的过程。在模拟结合界面形成时，依次考虑了连接过程中的三个阶段，包括加载、卸载和冷却。结果表明，根据是否发生熔化，可以获得三种类型的结合界面。分析了每个阶段三种类型结合界面的形态和原子结构。结合界面附近纳米晶粒的形成主要归因于熔化及随后的冷却过程。拉伸试验的原子模拟表明，熔化不是形成结合界面的必要因素。此外，根据是否发生熔化，连接机制可被视为压力焊接或熔合-扩散焊接。
