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双金属界面行为的分子动力学模拟综述

Review of Molecular Dynamics Simulation of Bimetallic Interfacial Behavior.

作者信息

Wang Xiaoqiong, Wang Yuejia, Li Guangyu, Jiang Wenming, Wang Jun, Kang Xing, Zeng Qiantong, Yao Shan, Yao Pingkun

机构信息

School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China.

Ningbo Institute of Dalian University of Technology, Dalian University of Technology, Ningbo 315000, China.

出版信息

Materials (Basel). 2025 Jun 26;18(13):3048. doi: 10.3390/ma18133048.

DOI:10.3390/ma18133048
PMID:40649536
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12251411/
Abstract

Bimetals have broad application prospects in many fields due to the combination of the performance characteristics of the two materials, but weak interface bonding limits their promotion and application. Therefore, studying the interfacial behavior to achieve bimetallic strengthening is the focus of this field. However, it is often difficult or costly to visually observe the interfacial behavior using traditional experimental methods. Molecular dynamics (MD) is an advanced microscopic simulation method that can conveniently, rapidly, accurately and intuitively study the diffusion and mechanical behavior at the bimetallic interfaces, providing a powerful tool and theoretical guidance to reveal the nature of interfacial bonding and the strengthening mechanism. This paper summarizes the research progress on molecular dynamics in the bimetallic formation process and mechanical behavior, including Al/Cu, Al/Mg, Al/Ni, Al/Ti, Al/Fe, Cu/Ni, and Fe/Cu. In addition, the future development direction is outlined to provide theoretical basis and experimental guidance for further exploring the formation process and performance enhancement of the bimetallic interfaces.

摘要

双金属由于两种材料性能特点的结合而在许多领域具有广阔的应用前景,但界面结合力较弱限制了它们的推广和应用。因此,研究界面行为以实现双金属强化是该领域的重点。然而,使用传统实验方法直观地观察界面行为往往困难或成本高昂。分子动力学(MD)是一种先进的微观模拟方法,能够方便、快速、准确且直观地研究双金属界面处的扩散和力学行为,为揭示界面结合本质和强化机制提供了有力工具和理论指导。本文综述了分子动力学在双金属形成过程和力学行为方面的研究进展,包括Al/Cu、Al/Mg、Al/Ni、Al/Ti、Al/Fe、Cu/Ni以及Fe/Cu。此外,概述了未来的发展方向,为进一步探索双金属界面的形成过程和性能提升提供理论依据和实验指导。

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