Chen Chien Han, Lin Ching Hsuan, Wang Meng Wei, Juang Tzong Yuan
Department of Chemical Engineering, National Chung Hsing University, 250 Kuo Kuang Road, Taichung 402, Taiwan.
Department of Cosmeceutics, China Medical University, 91 Hsueh-Shih Road, Taichung 402, Taiwan.
ACS Omega. 2017 Aug 22;2(8):4800-4807. doi: 10.1021/acsomega.7b00670. eCollection 2017 Aug 31.
Two diamines, bis[4-(4-(4-aminophenoxy)-2--butylphenoxy)phenyl] sulfone (PSNH) and 4,4'-bis[4-(4-aminophenoxy)-2--butylphenoxy)perfluorobiphenyl (PFNH), were prepared from 3--butyl-4-hydroxyanisole using a four-step procedure, including two nucleophilic substitutions, demethylation, and catalytic reduction. On the basis of PSNH and PFNH, two series of low dielectric polyetherimides (PEIs) were prepared. Both series of PEIs exhibit moderate-to-high thermal properties, including a glass transition temperature ( ) > 259 °C (depending on the rigidity of dianhydride), a 5 wt % decomposition temperature ( ) > 496 °C, and a coefficient of thermal expansion < 66 ppm/°C. Because of the hydrophobic -butyl phenylene oxide structure, both series of PEIs show excellent dielectric properties, with a dielectric constant as low as 2.4-2.7. The structure-property relationship of both series of PEIs is discussed in this work.
通过四步反应，包括两步亲核取代、脱甲基和催化还原，由3-丁基-4-羟基苯甲醚制备了两种二胺，双[4-(4-(4-氨基苯氧基)-2-丁基苯氧基)苯基]砜(PSNH)和4,4'-双[4-(4-氨基苯氧基)-2-丁基苯氧基]全氟联苯(PFNH)。基于PSNH和PFNH，制备了两个系列的低介电聚醚酰亚胺(PEI)。两个系列的PEI均表现出中等到较高的热性能，包括玻璃化转变温度(Tg)>259°C(取决于二酐的刚性)、5%失重温度(Td)>496°C和热膨胀系数<66ppm/°C。由于疏水性的丁基苯醚结构，两个系列的PEI均表现出优异的介电性能，介电常数低至2.4-2.7。本文讨论了两个系列PEI的结构-性能关系。
