Zhou Xiuyun, Lu Xiaochuan, Cao Xiaohan, Liu Zhen, Chen Yaqiu
School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China.
Rev Sci Instrum. 2019 Aug;90(8):084901. doi: 10.1063/1.5062850.
With the wide usage of electronic packaging technologies such as Ball Grid Array in electronic industry, it is necessary to maintain its quality in order to meet the demand of electronic products for function, integration, and size reduction. However, as the size of solder joints in such technology decreases, the solder joints are more and more prone to defects. To solve the life prediction problem of small-size packages having interconnections in the high-density chip, a method based on the eddy current pulsed thermography (ECPT) is put forward to study the remaining life prediction of solder joints. A 3D induction heating finite element model is established, by which the crack length of defect solder joints can be distinguished using temperature field. At the same time, the remaining life of defect solder joints can be characterized by the length of the crack. Furthermore, the experiments are carried out on solder joints whose diameter is 0.4 mm. Both simulation and experiment results verify that it is reliable and convenient to use 3D induction heating based temperature field from ECPT to evaluate the remaining life of cracks in solder joints.
随着球栅阵列等电子封装技术在电子行业的广泛应用，为满足电子产品对功能、集成度和尺寸减小的需求，有必要保证其质量。然而，随着该技术中焊点尺寸减小，焊点越来越容易出现缺陷。为解决高密度芯片中具有互连的小尺寸封装的寿命预测问题，提出一种基于涡流脉冲热成像（ECPT）的方法来研究焊点的剩余寿命预测。建立了三维感应加热有限元模型，通过该模型利用温度场可以区分缺陷焊点的裂纹长度。同时，缺陷焊点的剩余寿命可以用裂纹长度来表征。此外，对直径为0.4mm的焊点进行了实验。仿真和实验结果均验证了利用ECPT基于三维感应加热的温度场来评估焊点裂纹剩余寿命是可靠且方便的。
