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电子设备中无铅焊点的可靠性问题。

Reliability issues of lead-free solder joints in electronic devices.

作者信息

Jiang Nan, Zhang Liang, Liu Zhi-Quan, Sun Lei, Long Wei-Min, He Peng, Xiong Ming-Yue, Zhao Meng

机构信息

School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China.

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China.

出版信息

Sci Technol Adv Mater. 2019 Jul 11;20(1):876-901. doi: 10.1080/14686996.2019.1640072. eCollection 2019.

DOI:10.1080/14686996.2019.1640072
PMID:31528239
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6735330/
Abstract

Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.

摘要

电子产品正朝着小型化、高集成度和多功能化发展，这无疑对电子封装中焊点的可靠性提出了更高要求。电子设备中约70%的故障发生在封装过程中，主要是由于焊点故障。随着环保意识的提高，无铅焊点近年来成为一个热点问题。本文综述了无铅焊点可靠性的研究进展，讨论了温度、振动、锡须和电迁移对焊点可靠性的影响。此外，根据焊点自身存在的问题分析了提高焊点可靠性的措施，为在役电子产品焊点可靠性研究提供了进一步的理论依据。

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