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高质量氮化硼纳米片及其仿生热导纸。

High-Quality Boron Nitride Nanosheets and Their Bioinspired Thermally Conductive Papers.

机构信息

Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies , Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences , Ningbo 315201 , China.

出版信息

ACS Appl Mater Interfaces. 2019 Oct 9;11(40):37247-37255. doi: 10.1021/acsami.9b11180. Epub 2019 Sep 27.

Abstract

Hexagonal boron nitride has displayed increased potential in heat dissipation applications due to its desirable high thermal conductivity and remarkable thermal stability. However, the large-yield and high-quality preparation of boron nitride nanosheets (BNNSs) has been still an enormous challenge. In present work, we developed a universal exfoliation strategy to synthesize few-layer and defect-free BNNSs, which involved the intercalation of hexafluorosilicates/sodium hydroxide into BN crystals followed by exfoliation through a mild stirring process. The yield and concentration of as-obtained BNNS reached up to 78.5% and 12.78 mg/mL, respectively. More importantly, this method has been proven to exfoliate other layered materials like graphene (G), MoS, and WS. These as-obtained BNNSs can be directly used for constructing freestanding papers with high thermal conductivities. Typically, the thermal conductivities of the BNNS-G hybrid paper were up to 63.5 W/mK along the in-plane direction and 7.4 W/mK along the through-plane direction. According to the thermal interface materials performance measures, BNNS-G hybrid paper shows great promising applications for heat transfer in integrated circuit packaging.

摘要

六方氮化硼因其高导热性和优异的热稳定性,在散热应用中显示出了更大的潜力。然而,大产量和高质量的氮化硼纳米片(BNNSs)的制备仍然是一个巨大的挑战。在本工作中,我们开发了一种通用的剥离策略,用于合成少层和无缺陷的 BNNSs,该策略涉及将六氟硅酸盐/氢氧化钠插入 BN 晶体中,然后通过温和的搅拌过程进行剥离。所得到的 BNNS 的产率和浓度分别高达 78.5%和 12.78mg/mL。更重要的是,这种方法已被证明可以剥离其他层状材料,如石墨烯(G)、MoS 和 WS。所得到的 BNNS 可以直接用于构建具有高热导率的独立纸张。通常,BNNS-G 杂化纸在面内方向的热导率高达 63.5 W/mK,在面外方向的热导率为 7.4 W/mK。根据热界面材料性能指标,BNNS-G 杂化纸在集成电路封装中的热传递方面具有很大的应用潜力。

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