Department of Radiation Oncology, University of Michigan, Ann Arbor, MI 48109, United States of America.
Phys Med Biol. 2020 Feb 4;65(3):035009. doi: 10.1088/1361-6560/ab6577.
The signal-to-noise properties of active matrix, flat-panel imagers (AMFPIs) limit the imaging performance of this x-ray imaging technology under conditions of low dose per image frame. This limitation can affect cone-beam computed tomography (CBCT) procedures where an AMFPI is used to acquire hundreds of image frames to form a single volumetric data set. An approach for overcoming this limitation is to replace the energy-integrating pixel circuits of AMFPI arrays with photon counting pixel circuits which examine the energy of each x-ray interaction and count those events whose signals exceed user-defined energy thresholds. A promising material for fabricating the circuits of such photon-counting detectors (PCDs) is polycrystalline silicon (poly-Si)-a semiconductor that facilitates economic manufacture of large area, monolithic arrays of the size presently provided by AMFPIs as well as provides good radiation damage resistance. In this paper, results are reported from a theoretical investigation of the potential for poly-Si PCDs to satisfy the count rate needs, while maintaining good energy resolution, of two CBCT applications-CBCT used for breast imaging and kilo-voltage CBCT used for providing localization information in image guided radiotherapy (referred to as BCT and kV-CBCT, respectively). The study focused on the performance of the critical first component of a PCD pixel circuit, the amplifier, under conditions relevant to the two applications. The study determined that, compared to the average input fluxes associated with BCT and kV-CBCT, a promising amplifier design employing poly-Si thin-film transistors can provide count rates two and four times in excess of those levels, respectively, assuming a dead time loss of 10%. In addition, calculational estimates based on foreseeable poly-Si circuit densities suggest that it should be possible to include sufficient circuitry to support 2 and 3 energy thresholds per pixel, respectively. Finally, prospects for further improvements are discussed.
有源矩阵平板成像仪(AMFPIs)的信噪比特性限制了这种 X 射线成像技术在每帧图像低剂量条件下的成像性能。这种限制会影响锥形束计算机断层扫描(CBCT)程序,其中使用 AMFPI 采集数百个图像帧以形成单个体积数据集。克服此限制的一种方法是用光子计数像素电路代替 AMFPI 阵列的能量积分像素电路,该电路检查每个 X 射线相互作用的能量,并对那些信号超过用户定义的能量阈值的事件进行计数。用于制造这种光子计数探测器(PCD)电路的有前途的材料是多晶硅(poly-Si)-一种半导体,它有利于经济地制造大面积、单片的阵列,其尺寸与 AMFPI 目前提供的尺寸相同,并且具有良好的辐射损伤抗性。在本文中,报告了对多晶硅 PCD 满足两个 CBCT 应用(用于乳房成像的 CBCT 和用于在图像引导放射治疗中提供定位信息的千伏 CBCT(分别称为 BCT 和 kV-CBCT)的计数率需求的潜力的理论研究结果。该研究侧重于与两种应用相关的 PCD 像素电路的关键第一部分,即放大器的性能。研究确定,与 BCT 和 kV-CBCT 相关的平均输入通量相比,采用多晶硅薄膜晶体管的有前途的放大器设计可以分别提供超过这些水平两倍和四倍的计数率,假设 10%的死时间损失。此外,基于可预见的多晶硅电路密度的计算估计表明,应该有可能分别为每个像素包含足够的电路来支持 2 和 3 个能量阈值。最后,讨论了进一步改进的前景。