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用于相变存储器的Ga-Sb薄膜的结晶行为和电学特性

Crystallization behavior and electrical characteristics of Ga-Sb thin films for phase change memory.

作者信息

Yin Qixun, Chen Leng

机构信息

School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China.

出版信息

Nanotechnology. 2020 May 22;31(21):215709. doi: 10.1088/1361-6528/ab7429. Epub 2020 Feb 7.

Abstract

In this work, we investigated the structural and conductivity stability of Ga-Sb thin films for phase change memory (PCM). The mass density and thickness change are significant for stability and reliability of PCM. The Ga-Sb thin films were deposited on SiO/Si (100) wafer using magnetron co-sputtering method. Phase identification revealed that nanoscale face center cubic structure GaSb and rhombohedral structure Sb formed in Ga-Sb thin films, the formation of phase Sb was more obvious in GaSb. Ga-Sb film exhibits an unusual behavior upon crystallization with less mass density and thickness change. The microstructure of GaSb thin films improved their structural (density and film thickness) characteristics: the crystal growth of {111} and {110} oriented grains in Ga-Sb thin films is obvious, the grains growth in GaSb thin films was more even and the bonding states in Ga-Sb thin films were more stable. In addition, the conductivity activation energy of Ga-Sb decreased with increasing Sb contents, thus the temperature stability of conductivity was improved. The structure transformation and conductivity activation energy of Ga-Sb phase change materials are in favor of mechanical stresses reduction and reliability enhancement of PCM. This study introduces the influence mechanism of structural and conductivity stability in Ga-Sb thin films and may provide reference for further testing in higher endurance performance phase change materials.

摘要

在这项工作中,我们研究了用于相变存储器(PCM)的Ga-Sb薄膜的结构和导电稳定性。质量密度和厚度变化对PCM的稳定性和可靠性至关重要。采用磁控共溅射法在SiO/Si(100)衬底上沉积Ga-Sb薄膜。相鉴定表明,Ga-Sb薄膜中形成了纳米级面心立方结构的GaSb和菱面体结构的Sb,在GaSb中Sb相的形成更为明显。Ga-Sb薄膜在结晶时表现出异常行为,质量密度和厚度变化较小。GaSb薄膜的微观结构改善了其结构(密度和膜厚)特性:Ga-Sb薄膜中{111}和{110}取向晶粒的晶体生长明显,GaSb薄膜中的晶粒生长更均匀,Ga-Sb薄膜中的键合状态更稳定。此外,Ga-Sb的导电激活能随Sb含量的增加而降低,从而提高了导电率的温度稳定性。Ga-Sb相变材料的结构转变和导电激活能有利于降低PCM的机械应力并提高其可靠性。本研究介绍了Ga-Sb薄膜结构和导电稳定性的影响机制,可为进一步测试更高耐久性的相变材料提供参考。

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