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Sn2.5Ag0.7Cu0.1RE/Cu无铅焊点在等温时效过程中界面金属间化合物演变及断裂机制的动态观察

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.

作者信息

Zhao Di, Zhang Keke, Ma Ning, Li Shijie, Yin Chenxiang, Huo Fupeng

机构信息

School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China.

Henan Province Key Laboratory of Nonferrous Metal Material Science and Processing Technology, Luoyang 471023, China.

出版信息

Materials (Basel). 2020 Feb 12;13(4):831. doi: 10.3390/ma13040831.

DOI:10.3390/ma13040831
PMID:32059528
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7078696/
Abstract

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original single scallop-type CuSn IMC gradually evolved into a planar double-layer IMC consisting of CuSn and CuSn IMCs with isothermal aging. In particular, the CuSn IMC grew towards the Cu substrate and the solder seam sides; growth toward the Cu substrate side was dominant during the isothermal aging process. The growth of CuSn IMC depended on the accumulated time at a certain temperature, where the growth rate of CuSn was higher than that of CuSn. Additionally, the growth of the interfacial IMC was mainly controlled by bulk diffusion mechanism, where the activation energies of CuSn and CuSn were 74.7 and 86.6 kJ/mol, respectively. The growth rate of CuSn was slightly faster than that of CuSn during isothermal aging. With increasing isothermal aging time, the shear strength of the solder joints decreased and showed a linear relationship with the thickness of CuSn. The fracture mechanism of the solder joints changed from ductile fracture to brittle fracture, and the fracture pathway transferred from the solder seam to the interfacial IMC layer.

摘要

研究了Sn2.5Ag0.7Cu0.1RE/Cu焊点微观结构演变的动态过程以及等温时效过程中界面金属间化合物（IMC）与焊点力学性能之间的关系。结果表明，随着等温时效，原始的单扇贝型CuSn IMC逐渐演变成由CuSn和CuSn IMC组成的平面双层IMC。特别是，CuSn IMC向Cu基体和焊缝两侧生长；在等温时效过程中，向Cu基体一侧的生长占主导。CuSn IMC的生长取决于在一定温度下的累积时间，其中CuSn的生长速率高于CuSn。此外，界面IMC的生长主要受体扩散机制控制，其中CuSn和CuSn的激活能分别为74.7和86.6 kJ/mol。在等温时效过程中，CuSn的生长速率略快于CuSn。随着等温时效时间的增加，焊点的剪切强度降低，并且与CuSn的厚度呈线性关系。焊点的断裂机制从韧性断裂转变为脆性断裂，断裂路径从焊缝转移到界面IMC层。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3f2/7078696/830df45526c0/materials-13-00831-g014.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3f2/7078696/7488a291d8e7/materials-13-00831-g003.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3f2/7078696/830df45526c0/materials-13-00831-g014.jpg

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Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis.热解合成的铜包覆石墨烯纳米片增强Sn2.5Ag0.7Cu0.1RE复合焊料的微观结构与性能
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