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含高岭土地质聚合物陶瓷增强体的Sn-3.0Ag-0.5Cu复合焊料在等温时效下的微观结构与力学性能表现

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.

作者信息

Zaimi Nur Syahirah Mohamad, Salleh Mohd Arif Anuar Mohd, Sandu Andrei Victor, Abdullah Mohd Mustafa Al Bakri, Saud Norainiza, Rahim Shayfull Zamree Abd, Vizureanu Petrica, Said Rita Mohd, Ramli Mohd Izrul Izwan

机构信息

Center of Excellence Geopolymer & Green Technology (CeGeoGTech), University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia.

Faculty of Chemical Engineering Technology, University Malaysia Perlis (UniMAP), Taman Muhibbah, Perlis 02600, Malaysia.

出版信息

Materials (Basel). 2021 Feb 7;14(4):776. doi: 10.3390/ma14040776.

DOI:10.3390/ma14040776
PMID:33562200
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7915092/
Abstract

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and CuSn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and CuSn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

摘要

本文阐述了在85℃、125℃和150℃温度下等温时效100、500和1000小时，对添加1wt%高岭土地质聚合物陶瓷（KGC）增强颗粒的Sn-3.0Ag-0.5Cu（SAC305）无铅焊料的影响。SAC305-KGC复合焊料通过粉末冶金采用混合微波烧结法制备，并在具有有机可焊性防腐剂表面处理的铜基板印刷电路板上进行回流焊。结果表明，添加KGC有利于提高界面金属间化合物（IMC）层的总厚度。在150℃和1000小时的较高等温时效下，SAC305-KGC复合焊料中的IMC层呈现出平面型形态。此外，发现等温时效过程中总界面IMC层和CuSn层的生长分别受体扩散和晶界过程控制。SAC305-KGC复合焊料中总界面IMC层和CuSn IMC的激活能分别为74 kJ/mol和104 kJ/mol。基于搭接剪切试验，SAC305-KGC复合焊料的剪切强度高于未增强的SAC305焊料。同时，对于SAC305-KGC复合焊料，在较高的时效温度和时间下，剪切试验后的焊点失效模式是脆性和韧性模式的组合。

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Growth kinetics of CuSn intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current.电流增强 Cu-液 Sn 界面反应中 CuSn 金属间化合物的生长动力学。
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Materials (Basel). 2022 Apr 8;15(8):2758. doi: 10.3390/ma15082758.
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Tin Whiskers' Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish.应力负载下锡须的行为及化学浸镀锡表面处理的缓解方法
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