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铜离子聚合物金属复合材料的制备与驱动

Fabrication and Actuation of Cu-Ionic Polymer Metal Composite.

作者信息

Yang Liang, Zhang Dongsheng, Zhang Xining, Tian Aifen

机构信息

School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China.

School of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China.

出版信息

Polymers (Basel). 2020 Feb 17;12(2):460. doi: 10.3390/polym12020460.

Abstract

In this study, Cu-Ionic polymer metal composites (Cu-IPMC) were fabricated using the electroless plating method. The properties of Cu-IPMC in terms of morphology, water loss rate, adhesive force, surface resistance, displacements, and tip forces were evaluated under direct current voltage. In order to understand the relationship between lengths and actuation properties, we developed two static models of displacements and tip forces. The deposited Cu layer is uniform and smooth and contains about 90% by weight of copper, according to the energy-dispersive X-ray spectroscopy (EDS) analysis data obtained. The electrodes adhere well (level of 5B) on the membrane, to ensure a better conductivity and improve the actuation performance. The penetration depth of needle-like electrodes can reach up to around 70 μm, and the structure shows concise without complex branches, to speed up the actuation. Overall the maximum displacement increased as the voltage increased. The applied voltage for the maximum force output is 8-9 V. The root mean square error (RMSE) and determination coefficient (DC) of the displacement and force models are 1.66 and 1.23, 0.96 and 0.86, respectively.

摘要

在本研究中,采用化学镀法制备了铜离子聚合物金属复合材料(Cu-IPMC)。在直流电压下,对Cu-IPMC的形貌、失水率、附着力、表面电阻、位移和尖端力等性能进行了评估。为了理解长度与驱动性能之间的关系,我们建立了两个关于位移和尖端力的静态模型。根据获得的能量色散X射线光谱(EDS)分析数据,沉积的铜层均匀且光滑,含铜量约为90%(重量)。电极在膜上附着良好(5B级),以确保更好的导电性并提高驱动性能。针状电极的穿透深度可达约70μm,结构简洁无复杂分支,以加快驱动速度。总体而言,最大位移随电压升高而增加。最大力输出的施加电压为8 - 9V。位移和力模型的均方根误差(RMSE)和决定系数(DC)分别为1.66和1.23、0.96和0.86。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0169/7077653/6333f0080f7d/polymers-12-00460-g001.jpg

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