Zhang Yafang, Li Wang, Huang Juhua, Cao Ming, Du Guoping
School of Mechatronics Engineering, Nanchang University, Nanchang 330031, China.
The Center of Collaboration and Innovation, Jiangxi University of Technology, Nanchang 330098, China.
Materials (Basel). 2020 Feb 17;13(4):894. doi: 10.3390/ma13040894.
In this work, expanded graphite/paraffin/silicone rubber composite phase-change materials (PCMs) were prepared by blending the expanded graphite (EG), paraffin wax (PW) and silicone rubber (SR) matrix. It has been shown that PW fully penetrates into the three dimensional (3D) pores of EG to form the EG/PW particles, which are sealed by SR and evenly embedded in the SR matrix. As a result of the excellent thermal stability of SR and the capillary force from the 3D pores of EG, the EG/PW/SR PCMs are found to have good shape stability and high reliability. After being baked in an oven at 150 °C for 24 h, the shape of the EG/PW/SR PCMs is virtually unchanged, and their weight loss and latent heat drop are only 7.91 wt % and 11.3 J/g, respectively. The latent heat of the EG/PW/SR composites can reach up to 43.6 and 41.8 J/g for the melting and crystallizing processes, respectively. The super cooling of PW decreased from 4.2 to 2.4 due to the heterogeneous nucleation on the large surface of EG and the sealing effect of the SR. Meanwhile, the thermal conductivity of the EG/PW/SR PCMs reaches 0.56 W·m·K, which is about 2.8 times and 3.73 times of pure PW and pristine SR, respectively. The novel EG/PW/SR PCMs with superior shape and thermal stabilities will have a potential application in heat energy storage and thermal interface materials (TIM) for electronic devices.
在这项工作中,通过将膨胀石墨(EG)、石蜡(PW)和硅橡胶(SR)基体共混制备了膨胀石墨/石蜡/硅橡胶复合相变材料(PCM)。结果表明,PW完全渗透到EG的三维(3D)孔隙中形成EG/PW颗粒,这些颗粒被SR密封并均匀地嵌入到SR基体中。由于SR具有优异的热稳定性以及EG的3D孔隙产生的毛细作用力,发现EG/PW/SR PCM具有良好的形状稳定性和高可靠性。在150℃的烘箱中烘烤24小时后,EG/PW/SR PCM的形状几乎不变,其重量损失和潜热下降分别仅为7.91 wt%和11.3 J/g。EG/PW/SR复合材料在熔化和结晶过程中的潜热分别可达43.6和41.8 J/g。由于EG大表面上的异质形核和SR的密封作用,PW的过冷度从4.2降低到2.4。同时,EG/PW/SR PCM的热导率达到0.56 W·m·K,分别约为纯PW和原始SR的2.8倍和3.73倍。具有优异形状和热稳定性的新型EG/PW/SR PCM在热能存储和电子设备的热界面材料(TIM)方面将具有潜在应用。