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填充氮化铝和三水合氧化铝的硅橡胶复合材料的性能

Performance of Silicone Rubber Composites Filled with Aluminum Nitride and Alumina Tri-Hydrate.

作者信息

Zheng Jianjun, He Shaojian, Wang Jiaqi, Fang Wenxuan, Xue Yang, Xie Liming, Lin Jun

机构信息

Inner Mongolia Electric Power Science & Research Institute, Hohhot 010020, China.

School of Renewable Energy, North China Electric Power University, Beijing 102206, China.

出版信息

Materials (Basel). 2020 May 29;13(11):2489. doi: 10.3390/ma13112489.

DOI:10.3390/ma13112489
PMID:32486048
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7321244/
Abstract

In this study, silicone rubber (SR) composites were prepared with various amounts of aluminum nitride (AlN) and alumina tri-hydrate (ATH), and vinyl tri-methoxysilane (VTMS) was also introduced to prepare SR/ATH/AlN-VTMS composites for comparison. Compared to the SR/ATH composites, the SR/ATH/AlN composites with higher AlN loading exhibited higher breakdown strength and thermal conductivity, which were further improved by the addition of VTMS. Such results were related to the enhanced rubber-filler interfacial interactions from VTMS coupling, as demonstrated by scanning electron microscopy (SEM) analysis and the curing behaviors of the SR composites. Moreover, by replacing ATH with VTMS-coupled AlN, the SR/ATH/AlN-VTMS composites also exhibited lower dielectric loss along with an increased dielectric constant, suggesting the promising application of VTMS-coupled AlN as a filler for the preparation of the SR composites as high-voltage insulators.

摘要

在本研究中,制备了含有不同量氮化铝(AlN)和三水合氧化铝(ATH)的硅橡胶(SR)复合材料,并且还引入乙烯基三甲氧基硅烷(VTMS)来制备SR/ATH/AlN-VTMS复合材料以作比较。与SR/ATH复合材料相比,具有较高AlN负载量的SR/ATH/AlN复合材料表现出更高的击穿强度和热导率,通过添加VTMS进一步提高。这些结果与VTMS偶联增强的橡胶-填料界面相互作用有关,扫描电子显微镜(SEM)分析和SR复合材料的固化行为证明了这一点。此外,通过用VTMS偶联的AlN替代ATH,SR/ATH/AlN-VTMS复合材料还表现出较低的介电损耗以及介电常数的增加,这表明VTMS偶联的AlN作为制备SR复合材料作为高压绝缘体的填料具有广阔的应用前景。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/78ec0e02ee4b/materials-13-02489-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/1758ee566875/materials-13-02489-g001.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/a9464db64c6d/materials-13-02489-g005.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/6b55a24ede9d/materials-13-02489-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/78ec0e02ee4b/materials-13-02489-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/1758ee566875/materials-13-02489-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/894461a3bfa1/materials-13-02489-g002.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/a9464db64c6d/materials-13-02489-g005.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ce86/7321244/78ec0e02ee4b/materials-13-02489-g008.jpg

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