二氧化铈纳米颗粒对铜/氧化铝陶瓷覆层复合材料界面的影响。

Effect of CeO Nanoparticles on Interface of Cu/AlO Ceramic Clad Composites.

作者信息

Fu YaBo, Chen HaoNan, Cao ZhiQiang, Huo YanQiu

机构信息

Zhejiang Provincial Key Laboratory for Cutting Tools, School of Pharmaceutical and Materials Engineering, Taizhou University, Taizhou 318000, China.

School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China.

出版信息

Materials (Basel). 2020 Mar 9;13(5):1240. doi: 10.3390/ma13051240.

DOI:10.3390/ma13051240

PMID:32182897

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7085061/

Abstract

Cu/AlO ceramic clad composites are widely used in electronic packaging and electrical contacts. However, the conductivity and strength of the interfacial layer are not fit for the demands. So CeO nanoparticles 24.3 nm in size, coated on AlO ceramic, promote a novel CeO-CuO-Cu system to improve the interfacial bonded strength. Results show that the atom content of O is increased to approximately 30% with the addition of CeO nanoparticles compared with the atom content without CeO in the interfacial layer of Cu/AlO ceramic clad composites. CeO nanoparticles coated on the surface of AlO ceramics can easily diffuse into the metallic Cu layer. CeO nanoparticles can accelerate to form the eutectic liquid of CuO-Cu as they have strong functions of storing and releasing O at an Ar pressure of 0.12 MPa. The addition of CeO nanoparticles is beneficial for promoting the bonded strength of the Cu/AlO ceramic clad composites. The bonded strength of the interface coated with nanoparticles of CeO is increased to 20.8% compared with that without CeO; moreover, the electric conductivity on the side of metallic Cu is 95% IACS. The study is of great significance for improving properties of Cu/AlO ceramic clad composites.

摘要

铜/氧化铝陶瓷复合层材料广泛应用于电子封装和电接触领域。然而，界面层的导电性和强度并不符合要求。因此，在氧化铝陶瓷上包覆尺寸为24.3纳米的氧化铈纳米颗粒，促进了一种新型的氧化铈-氧化铜-铜体系，以提高界面结合强度。结果表明，与铜/氧化铝陶瓷复合层材料界面层中未添加氧化铈时的原子含量相比，添加氧化铈纳米颗粒后氧的原子含量增加到约30%。包覆在氧化铝陶瓷表面的氧化铈纳米颗粒能够轻易扩散到金属铜层中。在0.12兆帕的氩气压力下，氧化铈纳米颗粒具有很强的储氧和释氧功能，能够加速氧化铜-铜共晶液的形成。添加氧化铈纳米颗粒有利于提高铜/氧化铝陶瓷复合层材料的结合强度。与未添加氧化铈的情况相比，包覆氧化铈纳米颗粒的界面结合强度提高到了20.8%；此外，金属铜一侧的电导率为95%国际退火铜标准。该研究对于改善铜/氧化铝陶瓷复合层材料的性能具有重要意义。