Wang Xu, Pan Xiaoqian, Liu Pengpeng, Xiao Zhu, Zhou Tao, Gan Chunlei, Wang Juan
School of Materials Science and Engineering, Central South University, Changsha 410083, China.
NIO, Shanghai 201800, China.
Materials (Basel). 2025 Apr 2;18(7):1606. doi: 10.3390/ma18071606.
This article presented an investigation into the microstructure evolution of a hot-extruded Cu-0.23AlO alloy during thermomechanical treatment. The results demonstrated that cold rolling deformation introduced high-density dislocations into the matrix, resulting in a significant enhancement in the strength of the Cu-0.23AlO alloy. Subsequent annealing at 500 for 1 h led to a reduction in dislocation density in the sample. Consequently, the strength of the sample decreased very slightly, while the elongation increased from 14% to 39%. There was little growth of the nano-scale AlO particles due to their excellent thermal stability, with the average size remaining approximately 10 nm after annealing. The comprehensive properties of the Cu-0.23AlO alloy were improved synchronously by thermomechanical treatment, with a tensile strength of 301 MPa and an electrical conductivity of 98.5%IACS. The calculation results of the strengthening mechanism indicated that refinement strengthening, work hardening and Orowan strengthening mainly contributed to the high strength of the Cu-0.23AlO alloy.
本文对热挤压Cu-0.23AlO合金在热机械处理过程中的微观结构演变进行了研究。结果表明,冷轧变形在基体中引入了高密度位错,从而显著提高了Cu-0.23AlO合金的强度。随后在500℃下退火1小时导致样品中位错密度降低。因此,样品的强度略有下降,而伸长率从14%增加到39%。由于纳米级AlO颗粒具有优异的热稳定性,其平均尺寸在退火后仍保持在约10nm,几乎没有生长。通过热机械处理,Cu-0.23AlO合金的综合性能得到同步改善,其抗拉强度为301MPa,电导率为98.5%IACS。强化机制的计算结果表明,细化强化、加工硬化和奥罗万强化是Cu-0.23AlO合金高强度的主要贡献因素。