Elloian Jeffrey, Sherman Jeffrey, Costa Tiago, Shi Chen, Shepard Kenneth
Department of Electrical Engineering, Columbia University, 500 W 120th St., New York, New York 10027.
J Vac Sci Technol A. 2020 May;38(3):033202. doi: 10.1116/1.5142494. Epub 2020 Mar 11.
The unique flexible and piezoelectric properties of polyvinylidene fluoride (PVDF) films would allow for new applications for integrated bioelectronic devices. The use of these films has been precluded by the difficulty in machining them into small, discrete features without damaging the properties of the material. The etching of piezoelectric PVDF by means of a 193 nm excimer laser is explored and characterized. Etch rates are shown for common laser fluence values, along with images of the quality of the cuts to provide the reader with an understanding of the compromise between etch rate and edge roughness. The authors describe a novel method for the etching of piezoelectric, -phase PVDF. While PVDF is flexible, acoustically matched to biological tissue, and has a wide resonance bandwidth, it is often overlooked as a piezoelectric material for micro-electrical-mechanical-system devices because of the difficulty in fabrication. In this paper, the authors characterize the etch rate and quality while using a 193 nm argon fluoride excimer laser for patterning.
聚偏二氟乙烯（PVDF）薄膜独特的柔韧性和压电特性可为集成生物电子设备带来新的应用。由于难以将这些薄膜加工成小的离散特征而不损害材料性能，其应用受到了限制。本文探索并表征了利用193 nm准分子激光对压电PVDF进行蚀刻的情况。文中给出了常见激光能量密度值下的蚀刻速率，以及切割质量的图像，以便读者了解蚀刻速率与边缘粗糙度之间的权衡。作者描述了一种蚀刻压电β相PVDF的新方法。虽然PVDF具有柔韧性，与生物组织声学匹配，且具有较宽的共振带宽，但由于制造困难，它常被忽视作为微机电系统设备的压电材料。在本文中，作者在使用193 nm氟化氩准分子激光进行图案化时，对蚀刻速率和质量进行了表征。
