Ding Li, Wang Yu, Sun Chuanlin, Shu Quan, Hu Tao, Xuan Shouhu, Gong Xinglong
CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, CAS Center for Excellence in Complex System Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China.
ACS Appl Mater Interfaces. 2020 May 6;12(18):20955-20964. doi: 10.1021/acsami.0c03996. Epub 2020 Apr 23.
This work reports a three-dimensional (3D) structured multifunctional sensor by connecting a magnetowhisker with a superflexible patterned skin film. Composed of percolation networks of silver nanowires, the patterned skin film is integrated via a simple template manufacturing method without increasing the complexity and sacrificing the flexibility. The as-prepared 3D structured sensor can realize the multimodal detection of out-of-plane tactile stimuli and details of noncontact environmental obstacles in multiple directions. Here, the sensor's perception behaviors on compression, pulling, magnetic field, sound waves, airflow, water level, water flow, and backwash are presented. Furthermore, the 3D structured sensor obtains outstanding mechanical robustness and stability for 8000 cycles, excellent sensitivity (12 800% when the applied pulling displacement was 3.5 mm; 152% T when the magnetic flux density variation was 40.6 mT), ultrahigh response time, and ultrahigh recovery time (∼5 ms), which may meet the industrial sensing requirement for artificial tactile electronics. Facile manufacturing processes and outstanding multimodal sensing characteristics make the 3D structured sensor to possess great potential to be implemented in the next-generation intelligent bionic equipment or systems.
这项工作报道了一种通过将磁须与超柔性图案化皮肤膜相连的三维（3D）结构化多功能传感器。图案化皮肤膜由银纳米线的渗流网络组成，通过一种简单的模板制造方法集成，既不增加复杂性，又不牺牲柔韧性。所制备的3D结构化传感器能够实现对平面外触觉刺激的多模态检测以及多个方向上非接触环境障碍物的细节检测。在此，展示了该传感器在压缩、拉伸、磁场、声波、气流、水位、水流和反冲洗方面的感知行为。此外，3D结构化传感器在8000次循环中具有出色的机械鲁棒性和稳定性、优异的灵敏度（当施加的拉伸位移为3.5 mm时为12800%；当磁通密度变化为40.6 mT时为152% T）、超高的响应时间和超高的恢复时间（约5 ms），这可能满足人工触觉电子学的工业传感要求。简便的制造工艺和出色的多模态传感特性使得3D结构化传感器在下一代智能仿生设备或系统中具有巨大的实现潜力。
