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使用透明胶带测试法对用于周围神经探针的聚对二甲苯聚合物基板上的金属附着力进行表征和分析。

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe.

作者信息

Seok Seonho, Park HyungDal, Kim Jinseok

机构信息

Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, Orsay 91400, France.

Center for Bionics, Korea Institute of Science and Technology (KIST), Seongbuk-gu, Seoul 02792, Korea.

出版信息

Micromachines (Basel). 2020 Jun 22;11(6):605. doi: 10.3390/mi11060605.

Abstract

This paper presents measurement and FEM (Finite Element Method) analysis of metal adhesion force to a parylene substrate for implantable neural probe. A test device composed of 300 nm-thick gold and 30 nm-thick titanium metal electrodes on top of parylene substrate was prepared. The metal electrodes suffer from delamination during wet metal patterning process; thus, CF plasma treatment was applied to the parylene substrate before metal deposition. The two thin film metal layers were deposited by e-beam evaporation process. Metal electrodes had 200 μm in width, 300 μm spacing between the metal lines, and 5 mm length as the neural probe. Adhesion force of the metal lines to parylene substrate was measured with scotch tape test. Angle between the scotch tape and the test device substrate changed from 60° to 90° during characterization. Force exerted the scotch tape was recorded as the function of displacement of the scotch tape. It was found that a peak was created in measured force-displacement curve due to metal delamination. Metal adhesion was estimated 1.3 J/m by referring to the force peak and metal width at the force-displacement curve. Besides, the scotch tape test was simulated to comprehend delamination behavior of the test through FEM modeling.

摘要

本文介绍了用于植入式神经探针的金属与聚对二甲苯衬底之间粘附力的测量及有限元法(FEM)分析。制备了一种测试装置,其在聚对二甲苯衬底顶部由300nm厚的金和30nm厚的钛金属电极组成。在湿法金属图案化过程中,金属电极会出现分层现象;因此,在金属沉积之前对聚对二甲苯衬底进行了CF等离子体处理。通过电子束蒸发工艺沉积了两层薄膜金属层。作为神经探针的金属电极宽度为200μm,金属线之间的间距为300μm,长度为5mm。用胶带试验测量金属线与聚对二甲苯衬底之间的粘附力。在表征过程中,胶带与测试装置衬底之间的角度从60°变为90°。记录胶带施加的力作为胶带位移的函数。发现由于金属分层,在测量的力-位移曲线中产生了一个峰值。通过参考力-位移曲线中的力峰值和金属宽度,估计金属粘附力为1.3J/m²。此外,通过有限元建模对胶带试验进行了模拟,以了解测试的分层行为。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/11f6/7345729/0f0425e8d8a6/micromachines-11-00605-g001.jpg

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