Kinner Lukas, List-Kratochvil Emil J W, Dimopoulos Theodoros
AIT Austrian Institute of Technology, Center for Energy, Photovoltaic Systems, Vienna, Austria. Institut für Physik, Institut für Chemie & IRIS Adlershof, Humboldt-Universität zu Berlin, Berlin, Germany.
Nanotechnology. 2020 Jun 25;31(36):365303. doi: 10.1088/1361-6528/ab97aa.
The present study investigates processing routes to obtain highly conductive and transparent electrodes of silver nanowires (AgNWs) on flexible polyethylene terephthalate (PET) substrate. The AgNWs are embedded into a UV-curable polymer to reduce the electrode roughness and enhance its stability. For the purpose of device integration, the AgNWs must partially protrude from the polymer, which demands that their embedding is followed by a transfer step from a host substrate to the final substrate. Since the AgNWs require some sort of curing (thermal or plasma) to reduce the electrode sheet resistance, a thermally stable host substrate is generally used. This study shows that both thermally stable polyimide, as well as temperature-sensitive PET can be used as flexible host substrates, combined with a gentle, AgNW plasma curing. This is possible by adjusting the fabrication sequence to accommodate the plasma curing step, depending on the host substrate. As a result, embedded AgNW electrodes, transferred from polyimide-to-PET and from PET-to-PET are obtained, with optical transmittance of ∼80% (including the substrate) and sheet resistance of ∼13 Ω/sq., similar to electrodes transferred from glass-to-glass substrates. The embedded AgNW electrodes on PET show superior performance in bending tests, as compared to indium-tin-oxide electrodes. The introduced approach, involving low-cost flexible substrates, AgNW spray-coating and plasma curing, is compatible with high-throughput, roll-to-roll processing.
本研究探究了在柔性聚对苯二甲酸乙二醇酯(PET)基板上获得高导电性和透明银纳米线(AgNWs)电极的加工路线。将AgNWs嵌入可紫外固化的聚合物中,以降低电极粗糙度并提高其稳定性。为了实现器件集成,AgNWs必须部分从聚合物中突出,这就要求在将其嵌入聚合物后,进行从主体基板转移到最终基板的步骤。由于AgNWs需要某种固化(热固化或等离子体固化)来降低电极的薄层电阻,因此通常使用热稳定的主体基板。本研究表明,热稳定的聚酰亚胺以及对温度敏感的PET都可以用作柔性主体基板,并结合温和的AgNWs等离子体固化。根据主体基板的不同,通过调整制造顺序以适应等离子体固化步骤,可以实现这一点。结果,获得了从聚酰亚胺转移到PET以及从PET转移到PET的嵌入式AgNWs电极,其光学透过率约为80%(包括基板),薄层电阻约为13 Ω/sq,与从玻璃转移到玻璃基板的电极相似。与氧化铟锡电极相比,PET上的嵌入式AgNWs电极在弯曲测试中表现出优异的性能。所引入的方法涉及低成本的柔性基板、AgNWs喷涂和等离子体固化,与高通量卷对卷加工兼容。