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使用515纳米波长的1.3皮秒激光源对含784条光束的因瓦合金进行微加工。

Micromachining of Invar with 784 Beams Using 1.3 ps Laser Source at 515 nm.

作者信息

Hauschwitz Petr, Stoklasa Bohumil, Kuchařík Jiří, Turčičová Hana, Písařík Michael, Brajer Jan, Rostohar Danijela, Mocek Tomáš, Duda Martin, Lucianetti Antonio

机构信息

HiLASE Centre, Institute of Physics, Czech Academy of Sciences, Za Radnici 828, 25241 Dolni Brezany, Czech Republic.

Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague, Brehova 7, 115 19 Prague, Czech Republic.

出版信息

Materials (Basel). 2020 Jul 2;13(13):2962. doi: 10.3390/ma13132962.

Abstract

To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a galvanometer scanner and HiLASE high-energy pulse laser system emitting ultrashort pulses at 515 nm allows drilling and cutting of invar foil with 784 beams at once with high precision and almost no thermal effects and heat-affected zone, thus significantly improving the throughput and efficiency.

摘要

为满足高分辨率有机发光二极管(OLED)显示器的要求,必须在金属荫罩内部制作精确且高质量的微米级图案。因瓦合金因其独特性能,特别是低热膨胀系数,已被选用于此应用。在本研究中,将介绍一种新型的、具有成本效益的因瓦合金多光束微加工方法。Meopta光束分裂、聚焦和监测模块与振镜扫描仪以及在515nm发射超短脉冲的HiLASE高能脉冲激光系统相结合,能够一次用784束光束对因瓦合金箔进行钻孔和切割,精度高且几乎没有热效应和热影响区,从而显著提高了产量和效率。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d33e/7372339/242d2d8b1199/materials-13-02962-g001.jpg

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