Imran Muhammad, Zhang Liangchi, Gain Asit Kumar
Laboratory for Precision and Nano Processing Technologies, School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW, 2052, Australia.
Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, 518055, Guangdong, China.
Sci Rep. 2020 Jul 16;10(1):11763. doi: 10.1038/s41598-020-68481-6.
The present study focuses on maintaining the temperature magnitude around heat-sensitive components (cloaked region) in advanced electronic devices by introducing convective elements using extended surface fins. A finite element analysis confirmed that with the aid of the convection component to thermal cloaking, heat flux can be redirected around the cloaked region as well as control the temperature. The simulation results were verified by experiment under natural convection corresponding to the simulation assumptions. It was found that when the heat source maintains its temperature at 100 °C and the heat sink remains at 0 °C, the temperature within the cloaked region can reduce by up to 15 °C, from ~ 50 °C with conventional cloaking to 35 °C with a well-designed array of surface fins. It is worth noting that experimental results are consistent with the simulation results.
本研究的重点是通过使用扩展表面翅片引入对流元件，来维持先进电子设备中热敏组件（隐身区域）周围的温度幅度。有限元分析证实，借助对流组件实现热隐身，热通量可以在隐身区域周围重新定向，并控制温度。模拟结果在与模拟假设相对应的自然对流条件下通过实验得到了验证。结果发现，当热源温度保持在100°C且散热器温度保持在0°C时，隐身区域内的温度可降低多达15°C，从传统隐身时的约50°C降至设计良好的表面翅片阵列时的35°C。值得注意的是，实验结果与模拟结果一致。
