Sharmoukh Walid, Cong Jiayan, Ali Basant A, Allam Nageh K, Kloo Lars
Inorganic Chemistry Department, National Research Centre, Tahrir Street, Dokki 12622, Egypt.
Center of Molecular Devices, Department of Chemistry, Chemical Science and Engineering, KTH Royal Institute of Technology, SE-10044 Stockholm, Sweden.
ACS Omega. 2020 Jun 29;5(27):16856-16864. doi: 10.1021/acsomega.0c02060. eCollection 2020 Jul 14.
Three novel donor-acceptor-π-acceptor-type compounds (WS5, WS6, and WS7) were synthesized and investigated in dye-sensitized solar cells (DSSCs) exploring the effect of conjugated linkers on device performance. The new dyes showed strong light-harvesting ability in the visible region with relatively high molar absorption coefficients (>21 800 M cm). This can be attributed to their intrinsic charge transfer (CT) from the arylamine to the acceptor group. Density functional theory (DFT) calculations revealed a favorable lowest unoccupied molecular orbital (LUMO) energy level, allowing efficient injection into the semiconductor conduction band after excitation. Upon application in DSSC devices, the WS5 dye containing 4,7-di(furan-2-yl)benzo[][1,2,5]thiadiazole as conjugated linker mediated the highest device power conversion efficiency (PCE) amounting to 5.5%. This is higher than that of the WS6-containing dye based on the 4,7-di(thiophen-2-yl)benzo[][1,2,5]thiadiazole linker (3.5%) and the WS7 dye based on the 4-(thiophen-2-yl)benzo[][1,2,5]thiadiazole linker (4.3%) under AM 1.5 G illumination. The present results show furan-based dye linker systems to have a significant potential for improving DSSC efficiencies.
合成了三种新型供体-受体-π-受体型化合物(WS5、WS6和WS7),并在染料敏化太阳能电池(DSSC)中进行了研究,以探索共轭连接体对器件性能的影响。这些新型染料在可见光区域表现出较强的光捕获能力,摩尔吸收系数相对较高(>21800 M cm)。这可归因于其从芳胺到受体基团的固有电荷转移(CT)。密度泛函理论(DFT)计算显示出有利的最低未占据分子轨道(LUMO)能级,使得激发后能够有效地注入半导体导带。在DSSC器件中应用时,含有4,7-二(呋喃-2-基)苯并[][1,2,5]噻二唑作为共轭连接体的WS5染料介导的器件功率转换效率(PCE)最高,达到5.5%。这高于基于4,7-二(噻吩-2-基)苯并[][1,2,5]噻二唑连接体的含WS6染料(3.5%)以及基于4-(噻吩-2-基)苯并[][1,2,5]噻二唑连接体的WS7染料(4.3%)在AM 1.5 G光照下的效率。目前的结果表明基于呋喃的染料连接体系统在提高DSSC效率方面具有巨大潜力。