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深入了解EH(E = Ge和Sn)供体-受体配合物的分解机制以及从溶液中获取锗薄膜的方法。

Insight into the Decomposition Mechanism of Donor-Acceptor Complexes of EH (E = Ge and Sn) and Access to Germanium Thin Films from Solution.

作者信息

Sinclair Jocelyn, Dai Guoliang, McDonald Robert, Ferguson Michael J, Brown Alex, Rivard Eric

机构信息

Department of Chemistry, University of Alberta, 11227 Saskatchewan Drive, Edmonton, Alberta, Canada T6G 2G2.

School of Chemistry, Biology and Materials Engineering, Suzhou University of Science and Technology, 2215009 Suzhou, P. R. China.

出版信息

Inorg Chem. 2020 Aug 3;59(15):10996-11008. doi: 10.1021/acs.inorgchem.0c01492. Epub 2020 Jul 20.

Abstract

Electron-donating -heterocyclic carbenes (Lewis bases, LB) and electron-accepting Lewis acids (LA) have been used in tandem to yield donor-acceptor complexes of inorganic tetrelenes LB·EH·LA (E = Si, Ge, and Sn). Herein, we introduce the new germanium (II) dihydride adducts ImMe·GeH·BH (ImMe = (HCNMe)C:) and ImPrMe·GeH·BH (ImPrMe = (MeCNPr)C:), with the former complex containing nearly 40 wt % germanium. The thermal release of bulk germanium from ImMe·GeH·BH (and its deuterated isotopologue ImMe·GeD·BD) was examined in solution, and a combined kinetic and computational investigation was undertaken to probe the mechanism by which Ge is liberated. Moreover, the thermolysis of ImMe·GeH·BH in solution cleanly affords conformal nanodimensional layers of germanium as thin films of variable thicknesses (20-70 nm) on silicon wafers. We also conducted a computational investigation into potential decomposition pathways for the germanium(II)- and tin(II)-dihydride complexes NHC·EH·BH (NHC = [(HCNR)C:]; R = 2,6-PrCH (Dipp), Me, and H; and E = Ge and Sn). Overall, this study introduces a mild and convenient solution-only protocol for the deposition of thin films of Ge, a widely used semiconductor in materials research and industry.

摘要

供电子的杂环卡宾(路易斯碱,LB)和吸电子的路易斯酸(LA)已被串联使用,以生成无机四价元素烯LB·EH·LA(E = Si、Ge和Sn)的供体-受体配合物。在此,我们介绍了新型的二氢化锗加合物ImMe·GeH·BH(ImMe = (HCNMe)C:)和ImPrMe·GeH·BH(ImPrMe = (MeCNPr)C:),前者配合物含有近40 wt%的锗。在溶液中研究了ImMe·GeH·BH(及其氘代同位素ImMe·GeD·BD)中块状锗的热释放,并进行了动力学和计算相结合的研究,以探究锗被释放的机理。此外,ImMe·GeH·BH在溶液中的热解能在硅片上干净地生成可变厚度(20 - 70 nm)的锗的共形纳米尺寸层薄膜。我们还对锗(II)和锡(II)的二氢化配合物NHC·EH·BH(NHC = [(HCNR)C:]; R = 2,6-PrCH (Dipp)、Me和H;E = Ge和Sn)的潜在分解途径进行了计算研究。总体而言,本研究介绍了一种温和且便捷的仅在溶液中进行的方法,用于沉积锗薄膜,锗是材料研究和工业中广泛使用的半导体。

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