Böhnke Philippa Ruth Christine, Kruppke Iris, Hoffmann David, Richter Mirko, Häntzsche Eric, Gereke Thomas, Kruppke Benjamin, Cherif Chokri
Institute of Textile Machinery and High Performance Materials Technology, TU Dresden, Hohe Straße 6, 01069 Dresden, Germany.
Institute of Materials Science, TU Dresden, Budapester Straße 27, 01069 Dresden, Germany.
Materials (Basel). 2020 Jul 23;13(15):3267. doi: 10.3390/ma13153267.
The present study proposed a novel process for the matrix decomposition of carbon-fiber-reinforced plastics (CFRPs). For this purpose, the influence of ultraviolet (UV) radiation paired with semiconductors on CFRP was analyzed. Then, suitable process parameters for superficial and in-depth matrix decomposition in CFRP were evaluated. The epoxy resin was decomposed most effectively without damaging the embedded carbon fiber by using a UV light-emitting diode (LED) spotlight (395 nm, Semray 4103 by Heraeus Noblelight) at a power level of 66% compared to the maximum power of the spotlight. Using a distance of 10 mm and a treatment duration of only 35-40 s achieved a depth of two layers with an area of 750 mm, which is suitable for technological CFRP repair procedures. In addition to the characterization of the process, the treated CFRP samples were analyzed based on several analytical methods, namely, light microscopy (LM), scanning electron microscopy (SEM), and atomic force microscopy (AFM). Subsequently, the prepared carbon fibers (CFs) were tested using filament tensiometry, single filament tensile tests, and thermogravimetric measurements. All analyses showed the power level of 66% to be superior to the use of 96% power. The gentle ("fiber friendly") matrix destruction reduced the damage to the surface of the fibers and maintained their properties, such as maximum elongation and maximum tensile strength, at the level of the reference materials.
本研究提出了一种用于碳纤维增强塑料（CFRP）基体分解的新工艺。为此，分析了紫外线（UV）辐射与半导体结合对CFRP的影响。然后，评估了CFRP表面和深度基体分解的合适工艺参数。与聚光灯的最大功率相比，使用功率为66%的紫外线发光二极管（LED）聚光灯（395 nm，贺利氏特种光源的Semray 4103）时，环氧树脂的分解效果最佳，且不会损坏嵌入的碳纤维。距离为10 mm且处理时间仅为35 - 40 s时，可实现两层深度、面积为750 mm的区域，这适用于CFRP的工艺修复程序。除了对该工艺进行表征外，还基于几种分析方法对处理后的CFRP样品进行了分析，即光学显微镜（LM）、扫描电子显微镜（SEM）和原子力显微镜（AFM）。随后，使用细丝张力测定法、单丝拉伸试验和热重测量对制备的碳纤维（CF）进行了测试。所有分析表明，66%的功率水平优于96%功率的使用。温和的（“纤维友好型”）基体破坏减少了对纤维表面的损伤，并使它们的性能，如最大伸长率和最大拉伸强度，保持在参考材料的水平。
