Department of Materials Science and Engineering, Tel-Aviv University, Ramat Aviv, Tel Aviv 6997801, Israel.
Space Environment Department, Soreq Nuclear Research Center, Yavne 81800, Israel.
Molecules. 2020 Sep 14;25(18):4203. doi: 10.3390/molecules25184203.
Thermally activated shape memory polymers (SMPs) can memorize a temporary shape at low temperature and return to their permanent shape at higher temperature. These materials can be used for light and compact space deployment mechanisms. The control of transition temperature and thermomechanical properties of epoxy-based SMPs can be done using functionalized polyhedral oligomeric silsesquioxane (POSS) additives, which are also known to improve the durability to atomic oxygen in the space environment. In this study, the influence of varying amounts of two types of POSS added to epoxy-based SMPs on the shape memory effect (SME) were studied. The first type contained amine groups, whereas the second type contained epoxide groups. The curing conditions were defined using differential scanning calorimetry and glass transition temperature () measurements. Thermomechanical and SME properties were characterized using dynamic mechanical analysis. It was found that SMPs containing amine-based POSS show higher , better shape fixity and faster recovery speed, while SMPs containing epoxide-based POSS have higher crosslinking density and show superior thermomechanical properties above . This work demonstrates how the and SME of SMPs can be controlled by the type and amount of POSS in an epoxy-based SMP nanocomposite for future space applications.
热致形状记忆聚合物(SMPs)可以在低温下记忆临时形状,并在较高温度下恢复其永久形状。这些材料可用于轻便紧凑的空间展开机构。可以使用官能化的多面体低聚倍半硅氧烷(POSS)添加剂来控制基于环氧树脂的 SMP 的转变温度和热机械性能,众所周知,这也可以提高在空间环境中对原子氧的耐久性。在这项研究中,研究了向基于环氧树脂的 SMP 中添加不同量的两种类型的 POSS 对形状记忆效应(SME)的影响。第一种类型含有胺基,而第二种类型含有环氧基。使用差示扫描量热法和玻璃化转变温度(Tg)测量来定义固化条件。使用动态力学分析来表征热机械和 SME 性能。结果发现,含有胺基 POSS 的 SMP 具有更高的 Tg、更好的形状固定性和更快的恢复速度,而含有环氧基 POSS 的 SMP 具有更高的交联密度,并在高于 Tg 时表现出优异的热机械性能。这项工作表明,如何通过在基于环氧树脂的 SMP 纳米复合材料中添加 POSS 的类型和数量来控制 SMP 的 Tg 和 SME,以满足未来空间应用的需求。