Ettahri Ouafaa, Oukaira Aziz, Ali Mohamed, Hassan Ahmad, Nabavi Morteza, Savaria Yvon, Lakhssassi Ahmed
Department of Engineering Computer Science, University of Québec in Outaouais, Gatineau, QC 18X 3X7, Canada.
Electrical Engineering Department, Polytechnique Montréal, Montréal, QC H3T 1J4, Canada.
Sensors (Basel). 2020 Oct 3;20(19):5657. doi: 10.3390/s20195657.
This paper proposes a real-time thermal monitoring method using embedded integrated sensor interfaces dedicated to industrial integrated system applications. Industrial sensor interfaces are complex systems that involve analog and mixed signals, where several parameters can influence their performance. These include the presence of heat sources near sensitive integrated circuits, and various heat transfer phenomena need to be considered. This creates a need for real-time thermal monitoring and management. Indeed, the control of transient temperature gradients or temperature differential variations as well as the prediction of possible induced thermal shocks and stress at early design phases of advanced integrated circuits and systems are essential. This paper addresses the growing requirements of microelectronics applications in several areas that experience fast variations in high-power density and thermal gradient differences caused by the implementation of different systems on the same chip, such as the new-generation 5G circuits. To mitigate adverse thermal effects, a real-time prediction algorithm is proposed and validated using the MCUXpresso tool applied to a Freescale embedded sensor board to monitor and predict its temperature profile in real time by programming the embedded sensor into the FRDM-KL26Z board. Based on discrete temperature measurements, the embedded system is used to predict, in advance, overheating situations in the embedded integrated circuit (IC). These results confirm the peak detection capability of the proposed algorithm that satisfactorily predicts thermal peaks in the FRDM-KL26Z board as modeled with a finite element thermal analysis tool (the Numerical Integrated elements for System Analysis (NISA) tool), to gauge the level of local thermomechanical stresses that may be induced. In this paper, the FPGA implementation and comparison measurements are also presented. This work provides a solution to the thermal stresses and local system overheating that have been a major concern for integrated sensor interface designers when designing integrated circuits in various high-performance technologies or harsh environments.
本文提出了一种用于工业集成系统应用的实时热监测方法，该方法使用嵌入式集成传感器接口。工业传感器接口是涉及模拟和混合信号的复杂系统，其中有几个参数会影响其性能。这些参数包括敏感集成电路附近热源的存在，并且需要考虑各种热传递现象。这就产生了对实时热监测和管理的需求。实际上，在先进集成电路和系统的早期设计阶段，控制瞬态温度梯度或温差变化以及预测可能引起的热冲击和应力至关重要。本文满足了微电子应用在几个领域不断增长的需求，这些领域由于在同一芯片上实施不同系统而经历高功率密度和热梯度差异的快速变化，例如新一代5G电路。为了减轻不利的热影响，提出了一种实时预测算法，并使用应用于飞思卡尔嵌入式传感器板的MCUXpresso工具进行了验证，通过将嵌入式传感器编程到FRDM-KL26Z板中来实时监测和预测其温度分布。基于离散温度测量，嵌入式系统用于预先预测嵌入式集成电路（IC）中的过热情况。这些结果证实了所提出算法的峰值检测能力，该算法能够令人满意地预测FRDM-KL26Z板中的热峰值，该峰值通过有限元热分析工具（系统分析数值集成元件（NISA）工具）进行建模，以评估可能引起的局部热机械应力水平。本文还介绍了FPGA实现和比较测量。这项工作为热应力和局部系统过热问题提供了解决方案，而热应力和局部系统过热一直是集成传感器接口设计人员在各种高性能技术或恶劣环境中设计集成电路时主要关注的问题。
