Wang Bolong, Li Guangyong, Xu Liang, Liao Jianhe, Zhang Xuetong
School of Materials Science and Engineering, Hainan University, 58 Renmin Avenue, Haikou 570228, P.R. China.
Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, P.R. China.
ACS Nano. 2020 Dec 22;14(12):16590-16599. doi: 10.1021/acsnano.0c05931. Epub 2020 Oct 12.
With the advent of the 5G era, electronic systems have become more and more powerful, miniaturized, integrated ,and intelligent. The thermal management of electronic systems requires more efficiency and multiple functions for their practical applications, especially for the portable 5G electronic devices of the future, as the undesired heat can cause thermal discomfort or even thermal injury to people who use these electronic devices. Herein, two thermal management strategies based on boron nitride (BN) aerogel films have been proposed and demonstrated for portable devices. First, a flexible BN aerogel film with high porosity (>96%), large specific surface area (up to 982 m g), and controllable thickness (in the range from 50 to 200 μm) was fabricated molecular precursor assembly, sublimation drying, and pyrolysis reaction in sequence. The resulting BN aerogel film individuals, serving as a thermal insulation protecting layer in portable electronics, can significantly reduce heat transfer from electronics to skin. Second, BN phase change composite films, made by dipping BN aerogel films into the melts of the organic phase change materials (, paraffin), can effectively cool the portable electronics as the organic phase change materials filled in the aerogel matrix can serve as a smart thermal-regulator to absorb the undesired heat solid-liquid phase transition. These two typical strategies of the flexible BN aerogel film-directed thermal management could assist in efforts to miniaturize, integrate, and intelligentialize portable 5G electronic devices in the future.
随着5G时代的到来,电子系统变得越来越强大、小型化、集成化和智能化。电子系统的热管理在实际应用中需要更高的效率和多功能性,特别是对于未来的便携式5G电子设备而言,因为不期望的热量会对使用这些电子设备的人造成热不适甚至热损伤。在此,针对便携式设备提出并展示了两种基于氮化硼(BN)气凝胶薄膜的热管理策略。首先,通过分子前驱体组装、升华干燥和热解反应依次制备了一种具有高孔隙率(>96%)、大比表面积(高达982 m²/g)和可控厚度(50至200μm)的柔性BN气凝胶薄膜。所得的BN气凝胶薄膜个体作为便携式电子产品中的隔热保护层,可显著减少从电子产品到皮肤的热传递。其次,将BN气凝胶薄膜浸入有机相变材料(如石蜡)熔体中制成的BN相变复合薄膜,由于填充在气凝胶基质中的有机相变材料可作为智能热调节器通过固液相变吸收不期望的热量,从而能有效地冷却便携式电子产品。这两种基于柔性BN气凝胶薄膜的典型热管理策略有助于未来便携式5G电子设备的小型化、集成化和智能化。